Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

In the present study, moisture and temperature distributions and residual stresses in plastic encapsulated integrated circuit (IC) packages are evaluated in order to assess product reliability. Finite element analyses are utilized to calculate hygro-thermally induced deformations and stresses in pla...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1997-08, Vol.20 (3), p.247-255
Hauptverfasser:	Sung Yi, Jing Sua Goh, Ji Cheng Yang
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Circuit testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Finite element methods Integrated circuit reliability Lead Moisture Plastic integrated circuit packaging Reflow soldering Residual stresses Silicon Temperature distribution
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