Sacrificial wafer bonding for planarization after very deep etching

A new technique is presented that provides planarization after a very deep etching step in silicon. This offers the possibility for resist spinning and layer patterning as well as realization of bridges or cantilevers across deep holes or grooves. The sacrificial wafer bonding technique contains a w...

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Veröffentlicht in:	Journal of microelectromechanical systems 1995-09, Vol.4 (3), p.151-157
Hauptverfasser:	Spiering, V.L., Berenschot, J.W., Elwenspoek, M., Fluitman, J.H.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Biomembranes Bridges Capacitive sensors Dry etching Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Planarization Polymers Resists Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Spinning Wafer bonding
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