Use of short-loop electrical measurements for yield improvement

Modern submicron processes are more sensitive to both random and systematic wafer-level process variation than ever before. Given the dimensional control limitations of new technologies, the amount of wafer-to-wafer and within wafer nonuniformity of many steps is becoming a significant fraction of t...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 1995-05, Vol.8 (2), p.150-159
Hauptverfasser:	Crid Yu, Tinaung Maung, Spanos, C.J., Boning, D.S., Chung, J.E., Hua-Yu Liu, Keh-Jeng Chang, Bartelink, D.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit testing Data mining Dielectrics Electric variables measurement Error correction Filters Lithography Metrology Semiconductor device modeling Thickness control
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