Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Three different types of underfill imperfections were considered; i.e., (1) interfacial delamination between the underfill encapsulant and the solder mask on the PCB (crack initiated at the tip of underfill fillet), (2) interfacial delamination between the chip and the underfill encapsulant (crack i...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2000-06, Vol.23 (2), p.323-333
Hauptverfasser:	Lau, J.H., Lee, S.-W.R., Chang, C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Capacitive sensors Chips Delaminating Delamination Encapsulation Fillets Fracture mechanics Masks Material properties Materials reliability Materials science Passivation Performance evaluation Plastics Shear tests Soldering Solders Studies Testing Thermal expansion Thermomechanical processes
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