Separation of low molecular siloxanes for electronic application by liquid-liquid extraction
Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only...
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| Veröffentlicht in: | IEEE transactions on electronics packaging manufacturing 1999-10, Vol.22 (4), p.295-298 |
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| creator | Urasaki, N. Wong, C.P. |
| description | Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-lR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin. |
| doi_str_mv | 10.1109/6104.816097 |
| format | Article |
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Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-lR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin.</description><identifier>ISSN: 1521-334X</identifier><identifier>EISSN: 1558-0822</identifier><identifier>DOI: 10.1109/6104.816097</identifier><identifier>CODEN: ITEPFL</identifier><language>eng</language><publisher>IEEE</publisher><subject>Adhesive strength ; Adhesives ; Circuit stability ; Conducting materials ; Creep ; Creep (materials) ; Electronic packaging thermal management ; Electronics packaging ; Liquid-liquid extraction ; Low molecular weights ; Resins ; Silicone resins ; Siloxanes ; Spectroscopy ; Thermal stability ; Water</subject><ispartof>IEEE transactions on electronics packaging manufacturing, 1999-10, Vol.22 (4), p.295-298</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2967-6346bb58d8afb28f34adc9db5df805bc7aeddb61acb9da7e61b2a37b35c7b7d93</citedby><cites>FETCH-LOGICAL-c2967-6346bb58d8afb28f34adc9db5df805bc7aeddb61acb9da7e61b2a37b35c7b7d93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/816097$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/816097$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Urasaki, N.</creatorcontrib><creatorcontrib>Wong, C.P.</creatorcontrib><title>Separation of low molecular siloxanes for electronic application by liquid-liquid extraction</title><title>IEEE transactions on electronics packaging manufacturing</title><addtitle>TEPM</addtitle><description>Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-lR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin.</description><subject>Adhesive strength</subject><subject>Adhesives</subject><subject>Circuit stability</subject><subject>Conducting materials</subject><subject>Creep</subject><subject>Creep (materials)</subject><subject>Electronic packaging thermal management</subject><subject>Electronics packaging</subject><subject>Liquid-liquid extraction</subject><subject>Low molecular weights</subject><subject>Resins</subject><subject>Silicone resins</subject><subject>Siloxanes</subject><subject>Spectroscopy</subject><subject>Thermal stability</subject><subject>Water</subject><issn>1521-334X</issn><issn>1558-0822</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkUtLxDAUhYMoOI6u3LnKShfSMY82j6WILxhwoYILoeRViGQmnaTFmX9vSweX4upc7vnu5cAB4ByjBcZI3jCMyoXADEl-AGa4qkSBBCGH40xwQWn5cQxOcv5CCJcVITPw-epalVTn4xrGBob4DVcxONMHlWD2IW7V2mXYxATdsO5SXHsDVdsGb6YrvYPBb3pvi0mg23ZJmdE7BUeNCtmd7XUO3h_u3-6eiuXL4_Pd7bIwRDJeMFoyrSthhWo0EQ0tlTXS6so2AlXacOWs1Qwro6VV3DGsiaJc08pwza2kc3A1_W1T3PQud_XKZ-NCGLLHPtcSS4kRQ3wgL_8khzxUcPwPUDBKGCYDeD2BJsWck2vqNvmVSrsao3ospR5LqadSBvpior1z7pfcmz-EOIma</recordid><startdate>19991001</startdate><enddate>19991001</enddate><creator>Urasaki, N.</creator><creator>Wong, C.P.</creator><general>IEEE</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>19991001</creationdate><title>Separation of low molecular siloxanes for electronic application by liquid-liquid extraction</title><author>Urasaki, N. ; Wong, C.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2967-6346bb58d8afb28f34adc9db5df805bc7aeddb61acb9da7e61b2a37b35c7b7d93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Adhesive strength</topic><topic>Adhesives</topic><topic>Circuit stability</topic><topic>Conducting materials</topic><topic>Creep</topic><topic>Creep (materials)</topic><topic>Electronic packaging thermal management</topic><topic>Electronics packaging</topic><topic>Liquid-liquid extraction</topic><topic>Low molecular weights</topic><topic>Resins</topic><topic>Silicone resins</topic><topic>Siloxanes</topic><topic>Spectroscopy</topic><topic>Thermal stability</topic><topic>Water</topic><toplevel>online_resources</toplevel><creatorcontrib>Urasaki, N.</creatorcontrib><creatorcontrib>Wong, C.P.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Urasaki, N.</au><au>Wong, C.P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Separation of low molecular siloxanes for electronic application by liquid-liquid extraction</atitle><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle><stitle>TEPM</stitle><date>1999-10-01</date><risdate>1999</risdate><volume>22</volume><issue>4</issue><spage>295</spage><epage>298</epage><pages>295-298</pages><issn>1521-334X</issn><eissn>1558-0822</eissn><coden>ITEPFL</coden><abstract>Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-lR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. 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| ispartof | IEEE transactions on electronics packaging manufacturing, 1999-10, Vol.22 (4), p.295-298 |
| issn | 1521-334X 1558-0822 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Adhesive strength Adhesives Circuit stability Conducting materials Creep Creep (materials) Electronic packaging thermal management Electronics packaging Liquid-liquid extraction Low molecular weights Resins Silicone resins Siloxanes Spectroscopy Thermal stability Water |
| title | Separation of low molecular siloxanes for electronic application by liquid-liquid extraction |
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