Warpage studies of HDI test vehicles during various thermal profilings
New techniques and technologies involved in the miniaturization of printed wiring board (PWB) fabrication are rapidly emerging. The quality, performance, and reliability of surface mount assemblies built on these next-generation boards will depend on many factors, including thermally induced warpage...
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| Veröffentlicht in: | IEEE transactions on advanced packaging 1999-11, Vol.22 (4), p.624-637 |
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| container_title | IEEE transactions on advanced packaging |
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| creator | Petriccione, G.J. Ume, I.C. |
| description | New techniques and technologies involved in the miniaturization of printed wiring board (PWB) fabrication are rapidly emerging. The quality, performance, and reliability of surface mount assemblies built on these next-generation boards will depend on many factors, including thermally induced warpage. Therefore, quantitative warpage measurement is critical in new PWB assembly design evaluation, and determining overall thermal performance characteristics. Using an automated infrared reflow oven simulation system, the warpage of six bare high density interconnect (HDI) samples is measured under two different heating profiles. Out-of-plane surface displacement is measured with a noncontact shadow Moire technique and resolution enhancement method called phase-stepping. The two types of samples evaluated were built for the purpose of warpage study, where physical data could be used to validate finite element analysis (FEA) results. The warpage results obtained with the two thermal profiles will be presented. |
| doi_str_mv | 10.1109/6040.803455 |
| format | Article |
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The warpage results obtained with the two thermal profiles will be presented.</description><subject>Assemblies</subject><subject>Assembly</subject><subject>Boards</subject><subject>Circuit boards</subject><subject>Density measurement</subject><subject>Displacement measurement</subject><subject>Fabrication</subject><subject>Finite element method</subject><subject>Heating</subject><subject>Infrared heating</subject><subject>Miniaturization</subject><subject>Ovens</subject><subject>Printed circuits</subject><subject>Testing</subject><subject>Thermal factors</subject><subject>Vehicles</subject><subject>Warpage</subject><subject>Wiring</subject><issn>1521-3323</issn><issn>1557-9980</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkDFPwzAQhS0EEqUwsTF5ggGlnB3biUdUKK1UiQXEGDnJuTVKm2Inlfj3uErFCNOd7n137_QIuWYwYQz0gwIBkxxSIeUJGTEps0TrHE4PPWdJmvL0nFyE8AnARC74iMw-jN-ZFdLQ9bXDQFtL508L2mHo6B7XrmrisO69267o3njX9oF2a_Qb09Cdb61rohIuyZk1TcCrYx2T99nz23SeLF9fFtPHZVIxzXSidG0hNWVtOdR1yY2ADFSJIq_KGixKKbRknIvMZEoAxi2olMmwtFwit-mY3A13o_VXH38sNi5U2DRmi_GzIppoBlzpSN7-SXKdCQWM_w_mmWJcQgTvB7DybQgebbHzbmP8d8GgOMRfHOIvhvgjfTPQDhF_yaP4A6Y_fwo</recordid><startdate>19991101</startdate><enddate>19991101</enddate><creator>Petriccione, G.J.</creator><creator>Ume, I.C.</creator><general>IEEE</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>19991101</creationdate><title>Warpage studies of HDI test vehicles during various thermal profilings</title><author>Petriccione, G.J. ; Ume, I.C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1919-69df03abdf20ddb2a40706be48cbd0fe5549512247a7640ec190c6a7ebf25e2f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Assemblies</topic><topic>Assembly</topic><topic>Boards</topic><topic>Circuit boards</topic><topic>Density measurement</topic><topic>Displacement measurement</topic><topic>Fabrication</topic><topic>Finite element method</topic><topic>Heating</topic><topic>Infrared heating</topic><topic>Miniaturization</topic><topic>Ovens</topic><topic>Printed circuits</topic><topic>Testing</topic><topic>Thermal factors</topic><topic>Vehicles</topic><topic>Warpage</topic><topic>Wiring</topic><toplevel>online_resources</toplevel><creatorcontrib>Petriccione, G.J.</creatorcontrib><creatorcontrib>Ume, I.C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Petriccione, G.J.</au><au>Ume, I.C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Warpage studies of HDI test vehicles during various thermal profilings</atitle><jtitle>IEEE transactions on advanced packaging</jtitle><stitle>TADVP</stitle><date>1999-11-01</date><risdate>1999</risdate><volume>22</volume><issue>4</issue><spage>624</spage><epage>637</epage><pages>624-637</pages><issn>1521-3323</issn><eissn>1557-9980</eissn><coden>ITAPFZ</coden><abstract>New techniques and technologies involved in the miniaturization of printed wiring board (PWB) fabrication are rapidly emerging. The quality, performance, and reliability of surface mount assemblies built on these next-generation boards will depend on many factors, including thermally induced warpage. Therefore, quantitative warpage measurement is critical in new PWB assembly design evaluation, and determining overall thermal performance characteristics. Using an automated infrared reflow oven simulation system, the warpage of six bare high density interconnect (HDI) samples is measured under two different heating profiles. Out-of-plane surface displacement is measured with a noncontact shadow Moire technique and resolution enhancement method called phase-stepping. The two types of samples evaluated were built for the purpose of warpage study, where physical data could be used to validate finite element analysis (FEA) results. The warpage results obtained with the two thermal profiles will be presented.</abstract><pub>IEEE</pub><doi>10.1109/6040.803455</doi><tpages>14</tpages></addata></record> |
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| ispartof | IEEE transactions on advanced packaging, 1999-11, Vol.22 (4), p.624-637 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Assemblies Assembly Boards Circuit boards Density measurement Displacement measurement Fabrication Finite element method Heating Infrared heating Miniaturization Ovens Printed circuits Testing Thermal factors Vehicles Warpage Wiring |
| title | Warpage studies of HDI test vehicles during various thermal profilings |
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