Monolithic two-dimensional arrays of micromachined microstructures for infrared applications

Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated that have very small thermal mass (c, about 10/sup -9/ J/K) and that are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from th...

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Veröffentlicht in:Proceedings of the IEEE 1998-08, Vol.86 (8), p.1679-1686
Hauptverfasser: Cole, B.E., Higashi, R.E., Wood, R.A.
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container_title Proceedings of the IEEE
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creator Cole, B.E.
Higashi, R.E.
Wood, R.A.
description Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated that have very small thermal mass (c, about 10/sup -9/ J/K) and that are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate (thermal conductance to the substrate g of 10/sup -7/ W/K). This thermal conductance is close to the smallest value possible (about 10/sup -8/ W/K) due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amount of infrared (IR) incident IR flux. Large arrays of such microstructures have been fabricated on silicon wafers, complete with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") for night-vision IR imaging and (2) large arrays of individually controllable IR microemitters. The latter provide dynamic infrared "scene generators" that allow realistic simulations of IR scenes, an important tool for the development of IR cameras and IR missile seekers.
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fullrecord <record><control><sourceid>crossref_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_5_704273</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>704273</ieee_id><sourcerecordid>10_1109_5_704273</sourcerecordid><originalsourceid>FETCH-LOGICAL-c310t-f295ff234f6500a11b611f9c0afcab4d1d47a3cbfb3f7fb78201656e93eaaf3b3</originalsourceid><addsrcrecordid>eNo9kM1Lw0AUxPegYK2CZ0979JL6XjYfzVGKWqHiRW9CeLvZR1eSbNhNkf73pqR4Gob5MQwjxB3CChGqx3xVQpaW6kIsAHCdVClWV-I6xh8AUHmhFuL73fe-dePeGTn--qRxne2j8z21kkKgY5SeZedM8B2ZvettM7s4hoMZD8FGyT5I13OgMIU0DK0zNE4V8UZcMrXR3p51Kb5enj8322T38fq2edolRiGMCadVzpyqjIscgBB1gciVAWJDOmuwyUpSRrNWXLIu1ylgkRe2UpaIlVZL8TD3nnbFYLkegusoHGuE-vREndfzExN6P6POWvuPncM_STpeEg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Monolithic two-dimensional arrays of micromachined microstructures for infrared applications</title><source>IEEE Electronic Library (IEL)</source><creator>Cole, B.E. ; Higashi, R.E. ; Wood, R.A.</creator><creatorcontrib>Cole, B.E. ; Higashi, R.E. ; Wood, R.A.</creatorcontrib><description>Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated that have very small thermal mass (c, about 10/sup -9/ J/K) and that are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate (thermal conductance to the substrate g of 10/sup -7/ W/K). This thermal conductance is close to the smallest value possible (about 10/sup -8/ W/K) due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amount of infrared (IR) incident IR flux. Large arrays of such microstructures have been fabricated on silicon wafers, complete with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") for night-vision IR imaging and (2) large arrays of individually controllable IR microemitters. The latter provide dynamic infrared "scene generators" that allow realistic simulations of IR scenes, an important tool for the development of IR cameras and IR missile seekers.</description><identifier>ISSN: 0018-9219</identifier><identifier>DOI: 10.1109/5.704273</identifier><identifier>CODEN: IEEPAD</identifier><language>eng</language><publisher>IEEE</publisher><subject>Electronic circuits ; Energy exchange ; Infrared heating ; Infrared image sensors ; Microstructure ; Sensor arrays ; Silicon ; Temperature control ; Temperature sensors ; Thermal conductivity</subject><ispartof>Proceedings of the IEEE, 1998-08, Vol.86 (8), p.1679-1686</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c310t-f295ff234f6500a11b611f9c0afcab4d1d47a3cbfb3f7fb78201656e93eaaf3b3</citedby><cites>FETCH-LOGICAL-c310t-f295ff234f6500a11b611f9c0afcab4d1d47a3cbfb3f7fb78201656e93eaaf3b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/704273$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/704273$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Cole, B.E.</creatorcontrib><creatorcontrib>Higashi, R.E.</creatorcontrib><creatorcontrib>Wood, R.A.</creatorcontrib><title>Monolithic two-dimensional arrays of micromachined microstructures for infrared applications</title><title>Proceedings of the IEEE</title><addtitle>JPROC</addtitle><description>Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated that have very small thermal mass (c, about 10/sup -9/ J/K) and that are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate (thermal conductance to the substrate g of 10/sup -7/ W/K). This thermal conductance is close to the smallest value possible (about 10/sup -8/ W/K) due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amount of infrared (IR) incident IR flux. Large arrays of such microstructures have been fabricated on silicon wafers, complete with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") for night-vision IR imaging and (2) large arrays of individually controllable IR microemitters. The latter provide dynamic infrared "scene generators" that allow realistic simulations of IR scenes, an important tool for the development of IR cameras and IR missile seekers.</description><subject>Electronic circuits</subject><subject>Energy exchange</subject><subject>Infrared heating</subject><subject>Infrared image sensors</subject><subject>Microstructure</subject><subject>Sensor arrays</subject><subject>Silicon</subject><subject>Temperature control</subject><subject>Temperature sensors</subject><subject>Thermal conductivity</subject><issn>0018-9219</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1998</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kM1Lw0AUxPegYK2CZ0979JL6XjYfzVGKWqHiRW9CeLvZR1eSbNhNkf73pqR4Gob5MQwjxB3CChGqx3xVQpaW6kIsAHCdVClWV-I6xh8AUHmhFuL73fe-dePeGTn--qRxne2j8z21kkKgY5SeZedM8B2ZvettM7s4hoMZD8FGyT5I13OgMIU0DK0zNE4V8UZcMrXR3p51Kb5enj8322T38fq2edolRiGMCadVzpyqjIscgBB1gciVAWJDOmuwyUpSRrNWXLIu1ylgkRe2UpaIlVZL8TD3nnbFYLkegusoHGuE-vREndfzExN6P6POWvuPncM_STpeEg</recordid><startdate>19980801</startdate><enddate>19980801</enddate><creator>Cole, B.E.</creator><creator>Higashi, R.E.</creator><creator>Wood, R.A.</creator><general>IEEE</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19980801</creationdate><title>Monolithic two-dimensional arrays of micromachined microstructures for infrared applications</title><author>Cole, B.E. ; Higashi, R.E. ; Wood, R.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c310t-f295ff234f6500a11b611f9c0afcab4d1d47a3cbfb3f7fb78201656e93eaaf3b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Electronic circuits</topic><topic>Energy exchange</topic><topic>Infrared heating</topic><topic>Infrared image sensors</topic><topic>Microstructure</topic><topic>Sensor arrays</topic><topic>Silicon</topic><topic>Temperature control</topic><topic>Temperature sensors</topic><topic>Thermal conductivity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Cole, B.E.</creatorcontrib><creatorcontrib>Higashi, R.E.</creatorcontrib><creatorcontrib>Wood, R.A.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><jtitle>Proceedings of the IEEE</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Cole, B.E.</au><au>Higashi, R.E.</au><au>Wood, R.A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Monolithic two-dimensional arrays of micromachined microstructures for infrared applications</atitle><jtitle>Proceedings of the IEEE</jtitle><stitle>JPROC</stitle><date>1998-08-01</date><risdate>1998</risdate><volume>86</volume><issue>8</issue><spage>1679</spage><epage>1686</epage><pages>1679-1686</pages><issn>0018-9219</issn><coden>IEEPAD</coden><abstract>Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated that have very small thermal mass (c, about 10/sup -9/ J/K) and that are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate (thermal conductance to the substrate g of 10/sup -7/ W/K). This thermal conductance is close to the smallest value possible (about 10/sup -8/ W/K) due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amount of infrared (IR) incident IR flux. Large arrays of such microstructures have been fabricated on silicon wafers, complete with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") for night-vision IR imaging and (2) large arrays of individually controllable IR microemitters. The latter provide dynamic infrared "scene generators" that allow realistic simulations of IR scenes, an important tool for the development of IR cameras and IR missile seekers.</abstract><pub>IEEE</pub><doi>10.1109/5.704273</doi><tpages>8</tpages></addata></record>
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subjects Electronic circuits
Energy exchange
Infrared heating
Infrared image sensors
Microstructure
Sensor arrays
Silicon
Temperature control
Temperature sensors
Thermal conductivity
title Monolithic two-dimensional arrays of micromachined microstructures for infrared applications
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T09%3A58%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Monolithic%20two-dimensional%20arrays%20of%20micromachined%20microstructures%20for%20infrared%20applications&rft.jtitle=Proceedings%20of%20the%20IEEE&rft.au=Cole,%20B.E.&rft.date=1998-08-01&rft.volume=86&rft.issue=8&rft.spage=1679&rft.epage=1686&rft.pages=1679-1686&rft.issn=0018-9219&rft.coden=IEEPAD&rft_id=info:doi/10.1109/5.704273&rft_dat=%3Ccrossref_RIE%3E10_1109_5_704273%3C/crossref_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=704273&rfr_iscdi=true