Enhancement of flip-chip fatigue life by encapsulation

Encapsulation of controlled collapse chip connection (C4) joints, using a filled epoxy resin with a matched coefficient of thermal expansion (CTE), has provided a substantial increase in the life of C4 joints in accelerated thermal cycle (ATC) fatigue testing on both low CTE organic and ceramic chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1991-03, Vol.14 (1), p.218-223
Hauptverfasser:	Suryanarayana, D., Hsiao, R., Gall, T.P., McCreary, J.M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Ceramics Electronics Encapsulation Epoxy resins Exact sciences and technology Fatigue Life estimation Life testing Logic testing Rheology Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Temperature distribution Thermal expansion
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!