Flip-chip soldering to bare copper circuits

A process for providing highly reliable high-yield controlled-collapse ship connection (C4) joining to bare copper circuitry is described. It was studied in the course of implementing a major change in IBM's metallized ceramic and metallized ceramic polyimide (MCP) production line. The study in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.656-660
Hauptverfasser:	Ingraham, A.P., McCreary, J.M., Varcoe, J.A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Ceramics Circuits Copper Fatigue Marine vehicles Metallization Polyimides Production Soldering Tin
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!