Thermal analysis of integrated circuit devices and packages

The integrated circuit device is modeled as a four-layer structure with multiple heat sources located on the surface of the first layer and with the fourth layer representing the device package. Each layer is assumed to have the same rectangular dimensions. Using the separation of variables, an anal...

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Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1989-12, Vol.12 (4), p.701-709
Hauptverfasser:	Lee, C.C., Palisoc, A.L., Min, Y.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Boundary element methods Circuit analysis Computational modeling Design. Technologies. Operation analysis. Testing Electrodes Electronics Exact sciences and technology Integrated circuit modeling Integrated circuit packaging Integrated circuits Resistance heating Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface resistance Temperature measurement Thermal resistance
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