Direct chip interconnect with adhesive conductor films
Feasibility study results on direct chip interconnection (DCI) using anisotropic conductive polymer material on both flexible and rigid substrates are discussed. The concept is to simultaneously attach and electrically interconnect IC chips to circuit traces. When conductors are joined under heat an...
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| Veröffentlicht in: | IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.972-976 |
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| container_end_page | 976 |
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| container_issue | 6 |
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| container_title | IEEE transactions on components, hybrids, and manufacturing technology |
| container_volume | 15 |
| creator | Basavanhally, N.R. Chang, D.D. Cranston, B. Segar, S.G. |
| description | Feasibility study results on direct chip interconnection (DCI) using anisotropic conductive polymer material on both flexible and rigid substrates are discussed. The concept is to simultaneously attach and electrically interconnect IC chips to circuit traces. When conductors are joined under heat and pressure to form a bond, metallic spheres within the adhesive layer make contact with both surfaces but not each other, causing the anisotropic conductivity. Since process parameters (such as temperature, pressure, and cure time) as well as chip/substrate registration are equally critical to the success of making electrical interconnections, a real-time interconnect process monitor and methods to identify the root causes of interconnection failures during, and after, the bonding process were developed. The process monitor and the techniques used to verify the establishment of interconnections are elaborated.< > |
| doi_str_mv | 10.1109/33.206919 |
| format | Article |
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The concept is to simultaneously attach and electrically interconnect IC chips to circuit traces. When conductors are joined under heat and pressure to form a bond, metallic spheres within the adhesive layer make contact with both surfaces but not each other, causing the anisotropic conductivity. Since process parameters (such as temperature, pressure, and cure time) as well as chip/substrate registration are equally critical to the success of making electrical interconnections, a real-time interconnect process monitor and methods to identify the root causes of interconnection failures during, and after, the bonding process were developed. The process monitor and the techniques used to verify the establishment of interconnections are elaborated.< ></description><identifier>ISSN: 0148-6411</identifier><identifier>EISSN: 1558-3082</identifier><identifier>DOI: 10.1109/33.206919</identifier><identifier>CODEN: ITTEDR</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Anisotropic conductive films ; Anisotropic magnetoresistance ; Applied sciences ; Bonding ; Condition monitoring ; Conducting materials ; Conductive films ; Conductivity ; Contacts ; Electronic equipment and fabrication. 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The concept is to simultaneously attach and electrically interconnect IC chips to circuit traces. When conductors are joined under heat and pressure to form a bond, metallic spheres within the adhesive layer make contact with both surfaces but not each other, causing the anisotropic conductivity. Since process parameters (such as temperature, pressure, and cure time) as well as chip/substrate registration are equally critical to the success of making electrical interconnections, a real-time interconnect process monitor and methods to identify the root causes of interconnection failures during, and after, the bonding process were developed. The process monitor and the techniques used to verify the establishment of interconnections are elaborated.< ></description><subject>Anisotropic conductive films</subject><subject>Anisotropic magnetoresistance</subject><subject>Applied sciences</subject><subject>Bonding</subject><subject>Condition monitoring</subject><subject>Conducting materials</subject><subject>Conductive films</subject><subject>Conductivity</subject><subject>Contacts</subject><subject>Electronic equipment and fabrication. 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Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuit interconnections</topic><topic>Polymers</topic><toplevel>online_resources</toplevel><creatorcontrib>Basavanhally, N.R.</creatorcontrib><creatorcontrib>Chang, D.D.</creatorcontrib><creatorcontrib>Cranston, B.</creatorcontrib><creatorcontrib>Segar, S.G.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Basavanhally, N.R.</au><au>Chang, D.D.</au><au>Cranston, B.</au><au>Segar, S.G.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Direct chip interconnect with adhesive conductor films</atitle><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle><stitle>T-CHMT</stitle><date>1992-12-01</date><risdate>1992</risdate><volume>15</volume><issue>6</issue><spage>972</spage><epage>976</epage><pages>972-976</pages><issn>0148-6411</issn><eissn>1558-3082</eissn><coden>ITTEDR</coden><abstract>Feasibility study results on direct chip interconnection (DCI) using anisotropic conductive polymer material on both flexible and rigid substrates are discussed. The concept is to simultaneously attach and electrically interconnect IC chips to circuit traces. When conductors are joined under heat and pressure to form a bond, metallic spheres within the adhesive layer make contact with both surfaces but not each other, causing the anisotropic conductivity. Since process parameters (such as temperature, pressure, and cure time) as well as chip/substrate registration are equally critical to the success of making electrical interconnections, a real-time interconnect process monitor and methods to identify the root causes of interconnection failures during, and after, the bonding process were developed. The process monitor and the techniques used to verify the establishment of interconnections are elaborated.< ></abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/33.206919</doi><tpages>5</tpages></addata></record> |
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| identifier | ISSN: 0148-6411 |
| ispartof | IEEE transactions on components, hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.972-976 |
| issn | 0148-6411 1558-3082 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Anisotropic conductive films Anisotropic magnetoresistance Applied sciences Bonding Condition monitoring Conducting materials Conductive films Conductivity Contacts Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuit interconnections Polymers |
| title | Direct chip interconnect with adhesive conductor films |
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