A high-speed low 1/f noise SiGe HBT technology using epitaxially-aligned polysilicon emitters

A 200 mm 0.35 /spl mu/m silicon-germanium heterojunction bipolar transistor (SiGe HBT) technology involving epitaxially-aligned polysilicon emitters is described. The devices are shown to combine the high speed performances typical for poly-Si emitter SiGe base devices (f/sub max/ up to 70 GHz) and...

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Veröffentlicht in:IEEE transactions on electron devices 1999-07, Vol.46 (7), p.1525-1531
Hauptverfasser: Jouan, S., Planche, R., Baudry, H., Ribot, P., Chroboczek, J.A., Dutartre, D., Gloria, D., Laurens, M., Llinares, P., Marty, M., Monroy, A., Morin, C., Pantel, R., Perrotin, A., de Pontcharro, J., Regolini, J.L., Vincent, G., Chantre, A.
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container_end_page 1531
container_issue 7
container_start_page 1525
container_title IEEE transactions on electron devices
container_volume 46
creator Jouan, S.
Planche, R.
Baudry, H.
Ribot, P.
Chroboczek, J.A.
Dutartre, D.
Gloria, D.
Laurens, M.
Llinares, P.
Marty, M.
Monroy, A.
Morin, C.
Pantel, R.
Perrotin, A.
de Pontcharro, J.
Regolini, J.L.
Vincent, G.
Chantre, A.
description A 200 mm 0.35 /spl mu/m silicon-germanium heterojunction bipolar transistor (SiGe HBT) technology involving epitaxially-aligned polysilicon emitters is described. The devices are shown to combine the high speed performances typical for poly-Si emitter SiGe base devices (f/sub max/ up to 70 GHz) and the low 1/f noise properties of monocrystalline emitter structures (noise figure-of-merit KB as low as 7.2/spl times/10/sup -10/ /spl mu/m/sup 2/). Statistical current gain data are used to demonstrate the manufacturability of this innovative SiGe HBT technology.
doi_str_mv 10.1109/16.772506
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subjects Devices
Emitters
Epitaxy
Germanium alloys
Heterojunction bipolar transistors
High speed
Manufacturability
Noise
Silicon germanides
title A high-speed low 1/f noise SiGe HBT technology using epitaxially-aligned polysilicon emitters
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