On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. I. Transistor DC design considerations

The DC design considerations associated with optimizing epitaxial Si- and SiGe-base bipolar transistors for the 77-K environment are examined in detail. Transistors and circuits were fabricated using four different vertical profiles, three with a graded-bandgap SiGe base, and one with a Si base for...

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Veröffentlicht in:IEEE transactions on electron devices 1993-03, Vol.40 (3), p.525-541
Hauptverfasser: Cressler, J.D., Comfort, J.H., Crabbe, E.F., Patton, G.L., Stork, J.M.C., Sun, J.Y.-C., Meyerson, B.S.
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container_end_page 541
container_issue 3
container_start_page 525
container_title IEEE transactions on electron devices
container_volume 40
creator Cressler, J.D.
Comfort, J.H.
Crabbe, E.F.
Patton, G.L.
Stork, J.M.C.
Sun, J.Y.-C.
Meyerson, B.S.
description The DC design considerations associated with optimizing epitaxial Si- and SiGe-base bipolar transistors for the 77-K environment are examined in detail. Transistors and circuits were fabricated using four different vertical profiles, three with a graded-bandgap SiGe base, and one with a Si base for comparison. All four epitaxial-base profiles yield transistors with DC properties suitable for high-speed logic applications in the 77-K environment. The differences between the low-temperature DC characteristics of Si and SiGe transistors are highlighted both theoretically and experimentally. A performance tradeoff associated with the use of an intrinsic spacer layer to reduce parasitic leakage at low temperatures and the consequent base resistance degradation due to enhanced carrier freeze-out is identified. Evidence that a collector-base heterojunction barrier effect severely degrades the current drive and transconductance of SiGe-base transistors operating at low temperatures is provided.< >
doi_str_mv 10.1109/16.199358
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I. Transistor DC design considerations</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>1993-03</date><risdate>1993</risdate><volume>40</volume><issue>3</issue><spage>525</spage><epage>541</epage><pages>525-541</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract>The DC design considerations associated with optimizing epitaxial Si- and SiGe-base bipolar transistors for the 77-K environment are examined in detail. Transistors and circuits were fabricated using four different vertical profiles, three with a graded-bandgap SiGe base, and one with a Si base for comparison. All four epitaxial-base profiles yield transistors with DC properties suitable for high-speed logic applications in the 77-K environment. The differences between the low-temperature DC characteristics of Si and SiGe transistors are highlighted both theoretically and experimentally. A performance tradeoff associated with the use of an intrinsic spacer layer to reduce parasitic leakage at low temperatures and the consequent base resistance degradation due to enhanced carrier freeze-out is identified. Evidence that a collector-base heterojunction barrier effect severely degrades the current drive and transconductance of SiGe-base transistors operating at low temperatures is provided.&lt; &gt;</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/16.199358</doi><tpages>17</tpages></addata></record>
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source IEEE Electronic Library (IEL)
subjects Applied sciences
Bipolar transistors
Circuits
Degradation
Design optimization
Electronics
Exact sciences and technology
Germanium silicon alloys
Heterojunctions
Logic
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon germanium
Temperature
Transconductance
Transistors
title On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. I. Transistor DC design considerations
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