Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
Purpose - The purpose of this paper is to study epoxy and parylene C-coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.Design methodology approach - Epoxy coating is appli...
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| Veröffentlicht in: | Soldering & surface mount technology 2009-09, Vol.21 (4), p.4-11 |
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| creator | Kokko, Kati Harjunpää, Hanna Haltia, Anna-Maija Heino, Pekka Kellomäki, Minna |
| description | Purpose - The purpose of this paper is to study epoxy and parylene C-coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.Design methodology approach - Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip-chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 85°C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross-sectioning failed samples and using scanning electron microscopy for closer analysis.Findings - The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy.Originality value - The paper shows the influence of certain conformal coatings on the reliability of adhesive flip-chip joints. In medical applications, reliability plays an important role. |
| doi_str_mv | 10.1108/09540910910989376 |
| format | Article |
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These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.Design methodology approach - Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip-chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 85°C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross-sectioning failed samples and using scanning electron microscopy for closer analysis.Findings - The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy.Originality value - The paper shows the influence of certain conformal coatings on the reliability of adhesive flip-chip joints. In medical applications, reliability plays an important role.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/09540910910989376</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Adhesives ; Applied sciences ; Coatings technology ; Conductivity ; Design. Technologies. Operation analysis. Testing ; Electrical conductivity ; Electronics ; Exact sciences and technology ; Failure analysis ; Humidity ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Integrated circuits ; Joining ; Joining materials ; Materials with purpose ; Physics ; Protective coatings ; Scanning probe microscopes, components and techniques ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Studies ; Testing, measurement, noise and reliability ; Thin film coatings</subject><ispartof>Soldering & surface mount technology, 2009-09, Vol.21 (4), p.4-11</ispartof><rights>Emerald Group Publishing Limited</rights><rights>2009 INIST-CNRS</rights><rights>Copyright Emerald Group Publishing Limited 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c450t-38793f20c3b4d23c21b9f040e97ea0b47895f697198c333702bcfa958bb8e0cd3</citedby><cites>FETCH-LOGICAL-c450t-38793f20c3b4d23c21b9f040e97ea0b47895f697198c333702bcfa958bb8e0cd3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540910910989376/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540910910989376/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11635,27924,27925,52686,52689</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21979238$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kokko, Kati</creatorcontrib><creatorcontrib>Harjunpää, Hanna</creatorcontrib><creatorcontrib>Haltia, Anna-Maija</creatorcontrib><creatorcontrib>Heino, Pekka</creatorcontrib><creatorcontrib>Kellomäki, Minna</creatorcontrib><title>Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective</title><title>Soldering & surface mount technology</title><description>Purpose - The purpose of this paper is to study epoxy and parylene C-coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.Design methodology approach - Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip-chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 85°C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross-sectioning failed samples and using scanning electron microscopy for closer analysis.Findings - The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy.Originality value - The paper shows the influence of certain conformal coatings on the reliability of adhesive flip-chip joints. In medical applications, reliability plays an important role.</description><subject>Adhesives</subject><subject>Applied sciences</subject><subject>Coatings technology</subject><subject>Conductivity</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electrical conductivity</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Failure analysis</subject><subject>Humidity</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Integrated circuits</subject><subject>Joining</subject><subject>Joining materials</subject><subject>Materials with purpose</subject><subject>Physics</subject><subject>Protective coatings</subject><subject>Scanning probe microscopes, components and techniques</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Technologies. Operation analysis. Testing</topic><topic>Electrical conductivity</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Failure analysis</topic><topic>Humidity</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Integrated circuits</topic><topic>Joining</topic><topic>Joining materials</topic><topic>Materials with purpose</topic><topic>Physics</topic><topic>Protective coatings</topic><topic>Scanning probe microscopes, components and techniques</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Studies</topic><topic>Testing, measurement, noise and reliability</topic><topic>Thin film coatings</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kokko, Kati</creatorcontrib><creatorcontrib>Harjunpää, Hanna</creatorcontrib><creatorcontrib>Haltia, Anna-Maija</creatorcontrib><creatorcontrib>Heino, Pekka</creatorcontrib><creatorcontrib>Kellomäki, Minna</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Access via ABI/INFORM (ProQuest)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kokko, Kati</au><au>Harjunpää, Hanna</au><au>Haltia, Anna-Maija</au><au>Heino, Pekka</au><au>Kellomäki, Minna</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2009-09-18</date><risdate>2009</risdate><volume>21</volume><issue>4</issue><spage>4</spage><epage>11</epage><pages>4-11</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><coden>SSMOEO</coden><abstract>Purpose - The purpose of this paper is to study epoxy and parylene C-coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.Design methodology approach - Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip-chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 85°C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross-sectioning failed samples and using scanning electron microscopy for closer analysis.Findings - The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy.Originality value - The paper shows the influence of certain conformal coatings on the reliability of adhesive flip-chip joints. In medical applications, reliability plays an important role.</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/09540910910989376</doi><tpages>8</tpages></addata></record> |
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| source | Emerald A-Z Current Journals |
| subjects | Adhesives Applied sciences Coatings technology Conductivity Design. Technologies. Operation analysis. Testing Electrical conductivity Electronics Exact sciences and technology Failure analysis Humidity Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Joining Joining materials Materials with purpose Physics Protective coatings Scanning probe microscopes, components and techniques Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Studies Testing, measurement, noise and reliability Thin film coatings |
| title | Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective |
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