Electron scattering at surfaces and grain boundaries in Cu thin films and wires

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Veröffentlicht in:Physical review. B, Condensed matter and materials physics Condensed matter and materials physics, 2011-12, Vol.84 (23), Article 235423
Hauptverfasser: Chawla, J. S., Gstrein, F., O’Brien, K. P., Clarke, J. S., Gall, D.
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container_issue 23
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container_title Physical review. B, Condensed matter and materials physics
container_volume 84
creator Chawla, J. S.
Gstrein, F.
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Gall, D.
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doi_str_mv 10.1103/PhysRevB.84.235423
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title Electron scattering at surfaces and grain boundaries in Cu thin films and wires
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