Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis

Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis

This study aims to upgrade the thermal performance of a passive solar system, specifically a Trombe wall (TW), by incorporating a metallic absorbent made of copper chips into its absorbent surfaces. The paper compares the thermal performance of a classic TW with that of a copper chip-enhanced TW. An...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International journal of low carbon technologies 2024-11, Vol.19, p.2587-2595
Hauptverfasser: Abbas, Ehsan Fadhil, Allehaibi, Moaz, AL-bonsrulah, Hussein A Z, Saleh, Ruya Najmaldeen, Alshukri, Mohammed J, Zaghib, Karim
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 2595
container_issue
container_start_page 2587
container_title International journal of low carbon technologies
container_volume 19
creator Abbas, Ehsan Fadhil
Allehaibi, Moaz
AL-bonsrulah, Hussein A Z
Saleh, Ruya Najmaldeen
Alshukri, Mohammed J
Zaghib, Karim
description This study aims to upgrade the thermal performance of a passive solar system, specifically a Trombe wall (TW), by incorporating a metallic absorbent made of copper chips into its absorbent surfaces. The paper compares the thermal performance of a classic TW with that of a copper chip-enhanced TW. An experimental test was set up for classic and copper chip–TW systems, and a full-day experiment was conducted in January 2018 to investigate the thermal performance under the same operating conditions. The experimental data were used to verify a mathematical model based on energy balance. The theoretical study agreed well with the experimental data, with a maximum error of 11% in the absorbent surface temperature valuation. The results revealed that adding copper chips to the TW system boosts its performance by increasing heat gains and improving thermal efficiency. It improves thermal efficiency and enhances the mean room temperature by 12.44% and 14.1%, respectively.
doi_str_mv 10.1093/ijlct/ctae214
format Article
fullrecord <record><control><sourceid>crossref</sourceid><recordid>TN_cdi_crossref_primary_10_1093_ijlct_ctae214</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1093_ijlct_ctae214</sourcerecordid><originalsourceid>FETCH-LOGICAL-c123t-fade927f93cae7fc2ab728f4fd667fd25fa8c068afdf9a6505fed503d4f78c4c3</originalsourceid><addsrcrecordid>eNpNkMtOw0AMRUcIJEphyX5-IHQeebJDVXlIldjAOjITO5kqnUQzQ0V-gO8mhS5YWLaur6-sw9itFHdSVHpld72JKxMBlUzP2EIWaZlIrbLzf_MluwphJ0RWpVos2PfGdeCMdS2PHfo99ByJrLHozMQH4iOEYA_Iw9CD5x1CPHrDFCLuw3zjh8-242YYR_TcdHbk1kVs_ewb3D3Hr1m3e3RxTrbugCHa9nfHwTVzQT8FG67ZBUEf8ObUl-z9cfO2fk62r08v64dtYqTSMSFosFIFVdoAFmQUfBSqpJSaPC-oURlBaUReAjVUQZ6JjLDJhG5SKkqTGr1kyV-u8UMIHqke5-_AT7UU9RFi_QuxPkHUP0APbbQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis</title><source>DOAJ Directory of Open Access Journals</source><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><source>Oxford Journals Open Access Collection</source><creator>Abbas, Ehsan Fadhil ; Allehaibi, Moaz ; AL-bonsrulah, Hussein A Z ; Saleh, Ruya Najmaldeen ; Alshukri, Mohammed J ; Zaghib, Karim</creator><creatorcontrib>Abbas, Ehsan Fadhil ; Allehaibi, Moaz ; AL-bonsrulah, Hussein A Z ; Saleh, Ruya Najmaldeen ; Alshukri, Mohammed J ; Zaghib, Karim</creatorcontrib><description>This study aims to upgrade the thermal performance of a passive solar system, specifically a Trombe wall (TW), by incorporating a metallic absorbent made of copper chips into its absorbent surfaces. The paper compares the thermal performance of a classic TW with that of a copper chip-enhanced TW. An experimental test was set up for classic and copper chip–TW systems, and a full-day experiment was conducted in January 2018 to investigate the thermal performance under the same operating conditions. The experimental data were used to verify a mathematical model based on energy balance. The theoretical study agreed well with the experimental data, with a maximum error of 11% in the absorbent surface temperature valuation. The results revealed that adding copper chips to the TW system boosts its performance by increasing heat gains and improving thermal efficiency. It improves thermal efficiency and enhances the mean room temperature by 12.44% and 14.1%, respectively.</description><identifier>ISSN: 1748-1325</identifier><identifier>EISSN: 1748-1325</identifier><identifier>DOI: 10.1093/ijlct/ctae214</identifier><language>eng</language><ispartof>International journal of low carbon technologies, 2024-11, Vol.19, p.2587-2595</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c123t-fade927f93cae7fc2ab728f4fd667fd25fa8c068afdf9a6505fed503d4f78c4c3</cites><orcidid>0000-0003-0959-0206 ; 0000-0001-9178-2404</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,864,27922,27923</link.rule.ids></links><search><creatorcontrib>Abbas, Ehsan Fadhil</creatorcontrib><creatorcontrib>Allehaibi, Moaz</creatorcontrib><creatorcontrib>AL-bonsrulah, Hussein A Z</creatorcontrib><creatorcontrib>Saleh, Ruya Najmaldeen</creatorcontrib><creatorcontrib>Alshukri, Mohammed J</creatorcontrib><creatorcontrib>Zaghib, Karim</creatorcontrib><title>Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis</title><title>International journal of low carbon technologies</title><description>This study aims to upgrade the thermal performance of a passive solar system, specifically a Trombe wall (TW), by incorporating a metallic absorbent made of copper chips into its absorbent surfaces. The paper compares the thermal performance of a classic TW with that of a copper chip-enhanced TW. An experimental test was set up for classic and copper chip–TW systems, and a full-day experiment was conducted in January 2018 to investigate the thermal performance under the same operating conditions. The experimental data were used to verify a mathematical model based on energy balance. The theoretical study agreed well with the experimental data, with a maximum error of 11% in the absorbent surface temperature valuation. The results revealed that adding copper chips to the TW system boosts its performance by increasing heat gains and improving thermal efficiency. It improves thermal efficiency and enhances the mean room temperature by 12.44% and 14.1%, respectively.</description><issn>1748-1325</issn><issn>1748-1325</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNpNkMtOw0AMRUcIJEphyX5-IHQeebJDVXlIldjAOjITO5kqnUQzQ0V-gO8mhS5YWLaur6-sw9itFHdSVHpld72JKxMBlUzP2EIWaZlIrbLzf_MluwphJ0RWpVos2PfGdeCMdS2PHfo99ByJrLHozMQH4iOEYA_Iw9CD5x1CPHrDFCLuw3zjh8-242YYR_TcdHbk1kVs_ewb3D3Hr1m3e3RxTrbugCHa9nfHwTVzQT8FG67ZBUEf8ObUl-z9cfO2fk62r08v64dtYqTSMSFosFIFVdoAFmQUfBSqpJSaPC-oURlBaUReAjVUQZ6JjLDJhG5SKkqTGr1kyV-u8UMIHqke5-_AT7UU9RFi_QuxPkHUP0APbbQ</recordid><startdate>20241111</startdate><enddate>20241111</enddate><creator>Abbas, Ehsan Fadhil</creator><creator>Allehaibi, Moaz</creator><creator>AL-bonsrulah, Hussein A Z</creator><creator>Saleh, Ruya Najmaldeen</creator><creator>Alshukri, Mohammed J</creator><creator>Zaghib, Karim</creator><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0003-0959-0206</orcidid><orcidid>https://orcid.org/0000-0001-9178-2404</orcidid></search><sort><creationdate>20241111</creationdate><title>Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis</title><author>Abbas, Ehsan Fadhil ; Allehaibi, Moaz ; AL-bonsrulah, Hussein A Z ; Saleh, Ruya Najmaldeen ; Alshukri, Mohammed J ; Zaghib, Karim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c123t-fade927f93cae7fc2ab728f4fd667fd25fa8c068afdf9a6505fed503d4f78c4c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Abbas, Ehsan Fadhil</creatorcontrib><creatorcontrib>Allehaibi, Moaz</creatorcontrib><creatorcontrib>AL-bonsrulah, Hussein A Z</creatorcontrib><creatorcontrib>Saleh, Ruya Najmaldeen</creatorcontrib><creatorcontrib>Alshukri, Mohammed J</creatorcontrib><creatorcontrib>Zaghib, Karim</creatorcontrib><collection>CrossRef</collection><jtitle>International journal of low carbon technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Abbas, Ehsan Fadhil</au><au>Allehaibi, Moaz</au><au>AL-bonsrulah, Hussein A Z</au><au>Saleh, Ruya Najmaldeen</au><au>Alshukri, Mohammed J</au><au>Zaghib, Karim</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis</atitle><jtitle>International journal of low carbon technologies</jtitle><date>2024-11-11</date><risdate>2024</risdate><volume>19</volume><spage>2587</spage><epage>2595</epage><pages>2587-2595</pages><issn>1748-1325</issn><eissn>1748-1325</eissn><abstract>This study aims to upgrade the thermal performance of a passive solar system, specifically a Trombe wall (TW), by incorporating a metallic absorbent made of copper chips into its absorbent surfaces. The paper compares the thermal performance of a classic TW with that of a copper chip-enhanced TW. An experimental test was set up for classic and copper chip–TW systems, and a full-day experiment was conducted in January 2018 to investigate the thermal performance under the same operating conditions. The experimental data were used to verify a mathematical model based on energy balance. The theoretical study agreed well with the experimental data, with a maximum error of 11% in the absorbent surface temperature valuation. The results revealed that adding copper chips to the TW system boosts its performance by increasing heat gains and improving thermal efficiency. It improves thermal efficiency and enhances the mean room temperature by 12.44% and 14.1%, respectively.</abstract><doi>10.1093/ijlct/ctae214</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0003-0959-0206</orcidid><orcidid>https://orcid.org/0000-0001-9178-2404</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 1748-1325
ispartof International journal of low carbon technologies, 2024-11, Vol.19, p.2587-2595
issn 1748-1325
1748-1325
language eng
recordid cdi_crossref_primary_10_1093_ijlct_ctae214
source DOAJ Directory of Open Access Journals; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; Oxford Journals Open Access Collection
title Enhancing thermal efficiency of passive solar heating systems through copper chip integration: experimental investigation and analysis
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T20%3A53%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Enhancing%20thermal%20efficiency%20of%20passive%20solar%20heating%20systems%20through%20copper%20chip%20integration:%20experimental%20investigation%20and%20analysis&rft.jtitle=International%20journal%20of%20low%20carbon%20technologies&rft.au=Abbas,%20Ehsan%20Fadhil&rft.date=2024-11-11&rft.volume=19&rft.spage=2587&rft.epage=2595&rft.pages=2587-2595&rft.issn=1748-1325&rft.eissn=1748-1325&rft_id=info:doi/10.1093/ijlct/ctae214&rft_dat=%3Ccrossref%3E10_1093_ijlct_ctae214%3C/crossref%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true