Mass transfer techniques for large-scale and high-density microLED arrays

Inorganic-based micro light-emitting diodes (microLEDs) offer more fascinating properties and unique demands in next-generation displays. However, the small size of the microLED chip (1–100 µ m) makes it extremely challenging for high efficiency and low cost to accurately, selectively, integrate millions of microLED chips. Recent impressive technological advances have overcome the drawbacks of traditional pick-and-place techniques when they were utilized in the assembly of microLED display, including the most broadly recognized laser lift-off technique, contact micro-transfer printing ( µ TP) technique, laser non-contact µ TP technique, and self-assembly technique. Herein, we firstly review the key developments in mass transfer technique and highlight their potential value, covering both the state-of-the-art devices and requirements for mass transfer in the assembly of the ultra-large-area display and virtual reality glasses. We begin with the significant challenges and the brief history of mass transfer technique, and expand that mass transfer technique is composed of two major techniques, namely, the epitaxial Lift-off technique and the pick-and-place technique. The basic concept and transfer effects for each representative epitaxial Lift-off and pick-and-place technique in mass transfer are then overviewed separately. Finally, the potential challenges and future research directions of mass transfer are discussed. The recent advancement of the mass transfer techniques is summarized. Basic principles of the substantial control of the interface adhesion for different mass transfer techniques are presented. The potential challenges and future research directions of mass transfer techniques are discussed.