Fabrication of mechanically reliable micrometric scale conductive pattern by direct pattern transfer using UV photopolymer penetration

A mechanically reliable micrometric scale conductive wire fabrication method was developed using silver paste. In order to increase the bonding strength between silver particles, a method was developed for filling the space between particles with UV photopolymer. The UV photopolymer covers the top o...

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Veröffentlicht in:	Journal of micromechanics and microengineering 2021-03, Vol.31 (3), p.35004
Hauptverfasser:	Harisha, Bairi Sri, Jeong, Si Hun, Lee, Min Seop, Yoo, Kisoo, Lim, Jiseok
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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