Three-axis force sensor miniaturized by 3D microstructuring using high-temperature punch creep-forming process

This study developed a small, three-axis force sensor with a 3D microstructure for installation into a robot gripper. The sensor was manufactured by high-temperature punch creep-forming of 5 μm thick single-crystal silicon (Si) cantilevers during an impurity diffusion process for piezoresistors. The...

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Veröffentlicht in:	Journal of micromechanics and microengineering 2021-02, Vol.31 (2), p.25009
Hauptverfasser:	Nimura, Kyosuke, Osaka, Kenji, Sawada, Kazuma, Uesugi, Akio, Sugano, Koji, Isono, Yoshitada
Format:	Artikel
Sprache:	eng
Schlagworte:	3D microstructuring generalized Maxwell model punch creep-forming three-axis force sensor viscoelasticity
Online-Zugang:	Volltext
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