Investigation on the mechanism of steel/steel solid-state bonding at low temperatures

The solid-state bonding of ultralow-carbon steels was conducted by hot pressing and subsequent isothermal holding at low temperatures ranging from 873 to 923 K. The evolution of the interfacial strength was found to consist of two stages; the first stage, where the increase in interfacial strength i...

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Veröffentlicht in:	Science and technology of welding and joining 2017-04, Vol.22 (3), p.257-263
Hauptverfasser:	Pongmorakot, K., Nambu, S., Shibuta, Y., Koseki, T.
Format:	Artikel
Sprache:	eng
Schlagworte:	Interfacial strength Molecular dynamics simulation Short-range atomic rearrangement Solid-state bonding Steel
Online-Zugang:	Volltext
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