Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders

Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders

The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. Wit...

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Veröffentlicht in:Materials and manufacturing processes 2015-01, Vol.30 (1), p.127-132
Hauptverfasser: Xu, Zengfeng, Sharma, Ashutosh, Lee, Soon Jae, Jung, Jae Pil
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Sprache:eng
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Coatings
Deposition
Joining
Melting
Optical
Silver
Soldering
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creator Xu, Zengfeng
Sharma, Ashutosh
Lee, Soon Jae
Jung, Jae Pil
description The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.
doi_str_mv 10.1080/10426914.2014.952035
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fullrecord <record><control><sourceid>crossref_infor</sourceid><recordid>TN_cdi_crossref_primary_10_1080_10426914_2014_952035</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1080_10426914_2014_952035</sourcerecordid><originalsourceid>FETCH-LOGICAL-c307t-40e2fbfc9ceda36bbb32f08d47d54ee071b8bb5f6c72bae777dafc7d046a9dc93</originalsourceid><addsrcrecordid>eNp9kMtKAzEUhoMoWC9v4CIvMDXXSWclpa0XKHTRisuQaxmZJkMSkb69M7Zu3ZxzOPzfv_gAeMBoitEMPWLESN1gNiVoGA0niPILMMGckoowwS-He4hUY-Ya3OT8iRBuBOYTYFfeO1Ng9HAbO-tSG_Zw5w69S6p8JQdjgB-ulPGtgoWbvrRGdXDpQm7LceSWbQ8XURVn4Tb8hraholM-358r8x248qrL7v68b8H782q3eK3Wm5e3xXxdGYpEqRhyxGtvGuOsorXWmhKPZpYJy5lzSGA905r72giilRNCWOWNsIjVqrGmobeAnXpNijkn52Wf2oNKR4mRHE3JP1NyNCVPpgbs6YS1wcd0UN8xdVYWdexi8kkF02ZJ_234AcU3cDk</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders</title><source>Business Source Complete</source><creator>Xu, Zengfeng ; Sharma, Ashutosh ; Lee, Soon Jae ; Jung, Jae Pil</creator><creatorcontrib>Xu, Zengfeng ; Sharma, Ashutosh ; Lee, Soon Jae ; Jung, Jae Pil</creatorcontrib><description>The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.</description><identifier>ISSN: 1042-6914</identifier><identifier>EISSN: 1532-2475</identifier><identifier>DOI: 10.1080/10426914.2014.952035</identifier><language>eng</language><publisher>Taylor &amp; Francis Group</publisher><subject>Coatings ; Deposition ; Joining ; Melting ; Optical ; Silver ; Soldering</subject><ispartof>Materials and manufacturing processes, 2015-01, Vol.30 (1), p.127-132</ispartof><rights>Copyright Taylor &amp; Francis Group, LLC 2015</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c307t-40e2fbfc9ceda36bbb32f08d47d54ee071b8bb5f6c72bae777dafc7d046a9dc93</citedby><cites>FETCH-LOGICAL-c307t-40e2fbfc9ceda36bbb32f08d47d54ee071b8bb5f6c72bae777dafc7d046a9dc93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27923,27924</link.rule.ids></links><search><creatorcontrib>Xu, Zengfeng</creatorcontrib><creatorcontrib>Sharma, Ashutosh</creatorcontrib><creatorcontrib>Lee, Soon Jae</creatorcontrib><creatorcontrib>Jung, Jae Pil</creatorcontrib><title>Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders</title><title>Materials and manufacturing processes</title><description>The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.</description><subject>Coatings</subject><subject>Deposition</subject><subject>Joining</subject><subject>Melting</subject><subject>Optical</subject><subject>Silver</subject><subject>Soldering</subject><issn>1042-6914</issn><issn>1532-2475</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp9kMtKAzEUhoMoWC9v4CIvMDXXSWclpa0XKHTRisuQaxmZJkMSkb69M7Zu3ZxzOPzfv_gAeMBoitEMPWLESN1gNiVoGA0niPILMMGckoowwS-He4hUY-Ya3OT8iRBuBOYTYFfeO1Ng9HAbO-tSG_Zw5w69S6p8JQdjgB-ulPGtgoWbvrRGdXDpQm7LceSWbQ8XURVn4Tb8hraholM-358r8x248qrL7v68b8H782q3eK3Wm5e3xXxdGYpEqRhyxGtvGuOsorXWmhKPZpYJy5lzSGA905r72giilRNCWOWNsIjVqrGmobeAnXpNijkn52Wf2oNKR4mRHE3JP1NyNCVPpgbs6YS1wcd0UN8xdVYWdexi8kkF02ZJ_234AcU3cDk</recordid><startdate>20150102</startdate><enddate>20150102</enddate><creator>Xu, Zengfeng</creator><creator>Sharma, Ashutosh</creator><creator>Lee, Soon Jae</creator><creator>Jung, Jae Pil</creator><general>Taylor &amp; Francis Group</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20150102</creationdate><title>Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders</title><author>Xu, Zengfeng ; Sharma, Ashutosh ; Lee, Soon Jae ; Jung, Jae Pil</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c307t-40e2fbfc9ceda36bbb32f08d47d54ee071b8bb5f6c72bae777dafc7d046a9dc93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Coatings</topic><topic>Deposition</topic><topic>Joining</topic><topic>Melting</topic><topic>Optical</topic><topic>Silver</topic><topic>Soldering</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xu, Zengfeng</creatorcontrib><creatorcontrib>Sharma, Ashutosh</creatorcontrib><creatorcontrib>Lee, Soon Jae</creatorcontrib><creatorcontrib>Jung, Jae Pil</creatorcontrib><collection>CrossRef</collection><jtitle>Materials and manufacturing processes</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xu, Zengfeng</au><au>Sharma, Ashutosh</au><au>Lee, Soon Jae</au><au>Jung, Jae Pil</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders</atitle><jtitle>Materials and manufacturing processes</jtitle><date>2015-01-02</date><risdate>2015</risdate><volume>30</volume><issue>1</issue><spage>127</spage><epage>132</epage><pages>127-132</pages><issn>1042-6914</issn><eissn>1532-2475</eissn><abstract>The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.</abstract><pub>Taylor &amp; Francis Group</pub><doi>10.1080/10426914.2014.952035</doi><tpages>6</tpages></addata></record>
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subjects Coatings
Deposition
Joining
Melting
Optical
Silver
Soldering
title Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T17%3A12%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_infor&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effect%20of%20Soldering%20Temperature%20on%20Wetting%20and%20Optical%20Density%20of%20Dip%20Coated%20Sn%20and%20Sn-3.5Ag%20Solders&rft.jtitle=Materials%20and%20manufacturing%20processes&rft.au=Xu,%20Zengfeng&rft.date=2015-01-02&rft.volume=30&rft.issue=1&rft.spage=127&rft.epage=132&rft.pages=127-132&rft.issn=1042-6914&rft.eissn=1532-2475&rft_id=info:doi/10.1080/10426914.2014.952035&rft_dat=%3Ccrossref_infor%3E10_1080_10426914_2014_952035%3C/crossref_infor%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true