Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers
The interaction of water with an interphase composed of a common commercial glass cloth silane finish and an epoxy resin is explored by neutron reflection. The silane finish was applied to the oxide surfaces of polished silicon wafers. The epoxy resin (diglycidyl ether of bisphenol A with dicyandiam...
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Veröffentlicht in: | The Journal of adhesion 1999-01, Vol.69 (1-2), p.139-163 |
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container_title | The Journal of adhesion |
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creator | Kent, M. S. McNamara, W. F. Baca, P. M. Wright, W. Domeier, L. A. Wong, Apollo P. Y. Wu, W. L. |
description | The interaction of water with an interphase composed of a common commercial glass cloth silane finish and an epoxy resin is explored by neutron reflection. The silane finish was applied to the oxide surfaces of polished silicon wafers. The epoxy resin (diglycidyl ether of bisphenol A with dicyandiamide curing agent) was then roll-coated over the silane finish and cured. Profiles of D
2
O in the interphase were measured by neutron reflection after varying periods of exposure to air saturated with D
2
O at 22°C and at 80°C. A significant uptake of D
2
O into the interphase region is observed after exposure at 80°C for 3 days. The D
2
O profile in the interphase can be described by a two-layer model composed of a thin (∼15 Å) layer with ∼50 vol% D
2
O next to the silicon oxide surface and a second layer corresponding to the remainder of the silane-epoxy mixed layer with a much lower D
2
O level. No excess D
2
O is detected (detection limit ∼3%) in the interface region under the same conditions if the silane finish is not present. For samples conditioned at 22°C, no D
2
O is detected in the silane interphase after exposure for 18 days, but a significant uptake is observed after exposure for 6 months. The profile in the latter case can again be described by a two-layer model with a thin D
2
O-rich layer near the silicon oxide surface. The nature of the interaction of D
2
O with the interphase is further probed by exposing samples to vacuum following humidity conditioning. After evacuation for ∼1 month, near complete removal of interfacial water is observed for samples conditioned at 80°C for 3 days and also at 22°C for 6 months. These observations are interpreted in terms of a reversible chemical interaction (hydrolysis) between water and the silane finish. |
doi_str_mv | 10.1080/00218469908015923 |
format | Article |
fullrecord | <record><control><sourceid>pascalfrancis_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1080_00218469908015923</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1434322</sourcerecordid><originalsourceid>FETCH-LOGICAL-c354t-9aea2d1b8303574be8393b23a21b32078109e2ad931cf8fab2465af5cca060fd3</originalsourceid><addsrcrecordid>eNqFkEtLAzEQgIMoWGp_gLccvMnWPNuseCnSaqEo-KDHZTabYGC7WZIVu__elFo8FPQ0zMz3zQyD0CUlY0oUuSGEUSUmeZ4SKnPGT9CASiEzqRg_RYNdP0uAOEejGF1JiFKE55wPkF9DZwKeVdGHtnO-wa7ByybVLGgHNX51NTQGr6A3IeKyx0_mswuJezG2Nnqn3GI2xvPWb3t8feAXrnHxAycuFZxOcQ02TbhAZxbqaEY_cYjeF_O3-8ds9fywvJ-tMs2l6LIcDLCKlooTLqeiNCqdWzIOjJackamiJDcMqpxTbZWFkomJBCu1BjIhtuJDRPdzdfAxBmOLNrgNhL6gpNg9rTh6WnKu9k4LUUNtAzTaxV9RcMEZS9jdHnON9WEDXz7UVdFBX_twcPhfW6b_6kdW0W07_g310ZDA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers</title><source>Taylor & Francis Journals Complete</source><creator>Kent, M. S. ; McNamara, W. F. ; Baca, P. M. ; Wright, W. ; Domeier, L. A. ; Wong, Apollo P. Y. ; Wu, W. L.</creator><creatorcontrib>Kent, M. S. ; McNamara, W. F. ; Baca, P. M. ; Wright, W. ; Domeier, L. A. ; Wong, Apollo P. Y. ; Wu, W. L.</creatorcontrib><description>The interaction of water with an interphase composed of a common commercial glass cloth silane finish and an epoxy resin is explored by neutron reflection. The silane finish was applied to the oxide surfaces of polished silicon wafers. The epoxy resin (diglycidyl ether of bisphenol A with dicyandiamide curing agent) was then roll-coated over the silane finish and cured. Profiles of D
2
O in the interphase were measured by neutron reflection after varying periods of exposure to air saturated with D
2
O at 22°C and at 80°C. A significant uptake of D
2
O into the interphase region is observed after exposure at 80°C for 3 days. The D
2
O profile in the interphase can be described by a two-layer model composed of a thin (∼15 Å) layer with ∼50 vol% D
2
O next to the silicon oxide surface and a second layer corresponding to the remainder of the silane-epoxy mixed layer with a much lower D
2
O level. No excess D
2
O is detected (detection limit ∼3%) in the interface region under the same conditions if the silane finish is not present. For samples conditioned at 22°C, no D
2
O is detected in the silane interphase after exposure for 18 days, but a significant uptake is observed after exposure for 6 months. The profile in the latter case can again be described by a two-layer model with a thin D
2
O-rich layer near the silicon oxide surface. The nature of the interaction of D
2
O with the interphase is further probed by exposing samples to vacuum following humidity conditioning. After evacuation for ∼1 month, near complete removal of interfacial water is observed for samples conditioned at 80°C for 3 days and also at 22°C for 6 months. These observations are interpreted in terms of a reversible chemical interaction (hydrolysis) between water and the silane finish.</description><identifier>ISSN: 0021-8464</identifier><identifier>EISSN: 1545-5823</identifier><identifier>EISSN: 1563-518X</identifier><identifier>DOI: 10.1080/00218469908015923</identifier><identifier>CODEN: JADNAJ</identifier><language>eng</language><publisher>Basingstoke: Taylor & Francis Group</publisher><subject>Adsorption and desorption kinetics; evaporation and condensation ; Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Electronics ; Exact sciences and technology ; Miscellaneous ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Semiconductor-device characterization, design, and modeling ; Solid-fluid interfaces ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>The Journal of adhesion, 1999-01, Vol.69 (1-2), p.139-163</ispartof><rights>Copyright Taylor & Francis Group, LLC 1999</rights><rights>2000 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c354t-9aea2d1b8303574be8393b23a21b32078109e2ad931cf8fab2465af5cca060fd3</citedby><cites>FETCH-LOGICAL-c354t-9aea2d1b8303574be8393b23a21b32078109e2ad931cf8fab2465af5cca060fd3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.tandfonline.com/doi/pdf/10.1080/00218469908015923$$EPDF$$P50$$Ginformaworld$$H</linktopdf><linktohtml>$$Uhttps://www.tandfonline.com/doi/full/10.1080/00218469908015923$$EHTML$$P50$$Ginformaworld$$H</linktohtml><link.rule.ids>314,780,784,4024,27923,27924,27925,59647,60436</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1434322$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kent, M. S.</creatorcontrib><creatorcontrib>McNamara, W. F.</creatorcontrib><creatorcontrib>Baca, P. M.</creatorcontrib><creatorcontrib>Wright, W.</creatorcontrib><creatorcontrib>Domeier, L. A.</creatorcontrib><creatorcontrib>Wong, Apollo P. Y.</creatorcontrib><creatorcontrib>Wu, W. L.</creatorcontrib><title>Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers</title><title>The Journal of adhesion</title><description>The interaction of water with an interphase composed of a common commercial glass cloth silane finish and an epoxy resin is explored by neutron reflection. The silane finish was applied to the oxide surfaces of polished silicon wafers. The epoxy resin (diglycidyl ether of bisphenol A with dicyandiamide curing agent) was then roll-coated over the silane finish and cured. Profiles of D
2
O in the interphase were measured by neutron reflection after varying periods of exposure to air saturated with D
2
O at 22°C and at 80°C. A significant uptake of D
2
O into the interphase region is observed after exposure at 80°C for 3 days. The D
2
O profile in the interphase can be described by a two-layer model composed of a thin (∼15 Å) layer with ∼50 vol% D
2
O next to the silicon oxide surface and a second layer corresponding to the remainder of the silane-epoxy mixed layer with a much lower D
2
O level. No excess D
2
O is detected (detection limit ∼3%) in the interface region under the same conditions if the silane finish is not present. For samples conditioned at 22°C, no D
2
O is detected in the silane interphase after exposure for 18 days, but a significant uptake is observed after exposure for 6 months. The profile in the latter case can again be described by a two-layer model with a thin D
2
O-rich layer near the silicon oxide surface. The nature of the interaction of D
2
O with the interphase is further probed by exposing samples to vacuum following humidity conditioning. After evacuation for ∼1 month, near complete removal of interfacial water is observed for samples conditioned at 80°C for 3 days and also at 22°C for 6 months. These observations are interpreted in terms of a reversible chemical interaction (hydrolysis) between water and the silane finish.</description><subject>Adsorption and desorption kinetics; evaporation and condensation</subject><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Miscellaneous</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Semiconductor-device characterization, design, and modeling</subject><subject>Solid-fluid interfaces</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0021-8464</issn><issn>1545-5823</issn><issn>1563-518X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNqFkEtLAzEQgIMoWGp_gLccvMnWPNuseCnSaqEo-KDHZTabYGC7WZIVu__elFo8FPQ0zMz3zQyD0CUlY0oUuSGEUSUmeZ4SKnPGT9CASiEzqRg_RYNdP0uAOEejGF1JiFKE55wPkF9DZwKeVdGHtnO-wa7ByybVLGgHNX51NTQGr6A3IeKyx0_mswuJezG2Nnqn3GI2xvPWb3t8feAXrnHxAycuFZxOcQ02TbhAZxbqaEY_cYjeF_O3-8ds9fywvJ-tMs2l6LIcDLCKlooTLqeiNCqdWzIOjJackamiJDcMqpxTbZWFkomJBCu1BjIhtuJDRPdzdfAxBmOLNrgNhL6gpNg9rTh6WnKu9k4LUUNtAzTaxV9RcMEZS9jdHnON9WEDXz7UVdFBX_twcPhfW6b_6kdW0W07_g310ZDA</recordid><startdate>19990101</startdate><enddate>19990101</enddate><creator>Kent, M. S.</creator><creator>McNamara, W. F.</creator><creator>Baca, P. M.</creator><creator>Wright, W.</creator><creator>Domeier, L. A.</creator><creator>Wong, Apollo P. Y.</creator><creator>Wu, W. L.</creator><general>Taylor & Francis Group</general><general>Taylor and Francis</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19990101</creationdate><title>Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers</title><author>Kent, M. S. ; McNamara, W. F. ; Baca, P. M. ; Wright, W. ; Domeier, L. A. ; Wong, Apollo P. Y. ; Wu, W. L.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c354t-9aea2d1b8303574be8393b23a21b32078109e2ad931cf8fab2465af5cca060fd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Adsorption and desorption kinetics; evaporation and condensation</topic><topic>Applied sciences</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Miscellaneous</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Semiconductor-device characterization, design, and modeling</topic><topic>Solid-fluid interfaces</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kent, M. S.</creatorcontrib><creatorcontrib>McNamara, W. F.</creatorcontrib><creatorcontrib>Baca, P. M.</creatorcontrib><creatorcontrib>Wright, W.</creatorcontrib><creatorcontrib>Domeier, L. A.</creatorcontrib><creatorcontrib>Wong, Apollo P. Y.</creatorcontrib><creatorcontrib>Wu, W. L.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>The Journal of adhesion</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kent, M. S.</au><au>McNamara, W. F.</au><au>Baca, P. M.</au><au>Wright, W.</au><au>Domeier, L. A.</au><au>Wong, Apollo P. Y.</au><au>Wu, W. L.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers</atitle><jtitle>The Journal of adhesion</jtitle><date>1999-01-01</date><risdate>1999</risdate><volume>69</volume><issue>1-2</issue><spage>139</spage><epage>163</epage><pages>139-163</pages><issn>0021-8464</issn><eissn>1545-5823</eissn><eissn>1563-518X</eissn><coden>JADNAJ</coden><abstract>The interaction of water with an interphase composed of a common commercial glass cloth silane finish and an epoxy resin is explored by neutron reflection. The silane finish was applied to the oxide surfaces of polished silicon wafers. The epoxy resin (diglycidyl ether of bisphenol A with dicyandiamide curing agent) was then roll-coated over the silane finish and cured. Profiles of D
2
O in the interphase were measured by neutron reflection after varying periods of exposure to air saturated with D
2
O at 22°C and at 80°C. A significant uptake of D
2
O into the interphase region is observed after exposure at 80°C for 3 days. The D
2
O profile in the interphase can be described by a two-layer model composed of a thin (∼15 Å) layer with ∼50 vol% D
2
O next to the silicon oxide surface and a second layer corresponding to the remainder of the silane-epoxy mixed layer with a much lower D
2
O level. No excess D
2
O is detected (detection limit ∼3%) in the interface region under the same conditions if the silane finish is not present. For samples conditioned at 22°C, no D
2
O is detected in the silane interphase after exposure for 18 days, but a significant uptake is observed after exposure for 6 months. The profile in the latter case can again be described by a two-layer model with a thin D
2
O-rich layer near the silicon oxide surface. The nature of the interaction of D
2
O with the interphase is further probed by exposing samples to vacuum following humidity conditioning. After evacuation for ∼1 month, near complete removal of interfacial water is observed for samples conditioned at 80°C for 3 days and also at 22°C for 6 months. These observations are interpreted in terms of a reversible chemical interaction (hydrolysis) between water and the silane finish.</abstract><cop>Basingstoke</cop><pub>Taylor & Francis Group</pub><doi>10.1080/00218469908015923</doi><tpages>25</tpages></addata></record> |
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subjects | Adsorption and desorption kinetics evaporation and condensation Applied sciences Condensed matter: structure, mechanical and thermal properties Electronics Exact sciences and technology Miscellaneous Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductor-device characterization, design, and modeling Solid-fluid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
title | Water Adsorption in Interfacial Silane Layers by Neutron Reflection: 2. Epoxy + Silane Finish on Silicon Wafers |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T13%3A36%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Water%20Adsorption%20in%20Interfacial%20Silane%20Layers%20by%20Neutron%20Reflection:%202.%20Epoxy%20+%20Silane%20Finish%20on%20Silicon%20Wafers&rft.jtitle=The%20Journal%20of%20adhesion&rft.au=Kent,%20M.%20S.&rft.date=1999-01-01&rft.volume=69&rft.issue=1-2&rft.spage=139&rft.epage=163&rft.pages=139-163&rft.issn=0021-8464&rft.eissn=1545-5823&rft.coden=JADNAJ&rft_id=info:doi/10.1080/00218469908015923&rft_dat=%3Cpascalfrancis_cross%3E1434322%3C/pascalfrancis_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |