Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces

We have found that the adhesive strength, P, of hot melt adhesives (HMAs) based on semi-crystalline polymers can be described by the following equation: 1 P = P 0 BD previously derived for tack of pressure sensitive adhesives (PSAs). 2,3 In this equation, P 0 is the interfacial adhesion between the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:The Journal of adhesion 1995-01, Vol.48 (1-4), p.149-167
1. Verfasser: Tse, M. F.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 167
container_issue 1-4
container_start_page 149
container_title The Journal of adhesion
container_volume 48
creator Tse, M. F.
description We have found that the adhesive strength, P, of hot melt adhesives (HMAs) based on semi-crystalline polymers can be described by the following equation: 1 P = P 0 BD previously derived for tack of pressure sensitive adhesives (PSAs). 2,3 In this equation, P 0 is the interfacial adhesion between the adhesive and the substrate, B is the bonding term, and D is the debonding term. This adhesion model is then applied to the development of HMA formulations based on Exxon Chemical's olefinic polymers and Escorez® tackifiers, bonded to Escorene® polypropylene and polyethylene substrate surfaces. Two olefinic polymers, Escorene® EVA polymer (ethylene/vinyl acetate copolymer) and Exact TM polymer, will be used. EVA polymer is the industrial leader in HMA applications, whereas Exact TM polymer is a new family of linear ethylene copolymer products made using a new class of proprietary catalysts. Therefore, performance of HMAs based on EVA polymer and Exact TM polymer is compared in the context of the P 0 , B, and D terms of our adhesion model. The interfacial adhesion P 0 term of these HMAs is generally governed by the surface tensions of the three HMA components: polymer, tackifier and wax. The bonding term, B, depends on the bonding temperature exponentially, and increases with the bonding time to a power of 1/6-1/2 at short bonding time. During the HMA bonding process, the low melt viscosity of the HMA facilitates sufficient spreading on a microscopically rough substrate surface. Therefore, the bonding term B is independent of the bonding pressure. The debonding term, D, depends on adhesive bulk properties. It is related to viscoelastic loss tangent in the industrial peel frequency range when the HMA/substrate assembly exhibits an apparent interfacial failure (AIF) mode, but to the tensile draw ratio at break of the bulk adhesive when the HMA/substrate assembly exhibits a mixed cohesive/apparent interfacial failure (CF/AIF) mode. Overall, compared with HMAs based on EVA polymers, HMAs based on Exact TM polymers show higher viscosity and inferior tensile strength, but better bond strength to polyolefin surfaces, higher strain at break, and lower yield stress.
doi_str_mv 10.1080/00218469508028160
format Article
fullrecord <record><control><sourceid>pascalfrancis_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1080_00218469508028160</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3459256</sourcerecordid><originalsourceid>FETCH-LOGICAL-c393t-d6a205bb6b6716e5e47d93b52f1399f1a45b954936928d1eb0b0b021fa815b6e3</originalsourceid><addsrcrecordid>eNp1kE1LAzEQhoMoWGp_gLccvK7mY5Mm4KVWa4UWBfUoS7JJNJBulmSt9N-7S6sXkTnMDPO8M8MLwDlGlxgJdIUQwaLkkvUNEZijIzDCrGQFE4Qeg9EwL3qgPAWTnL1GSAhEJaUj8DZr2-Br1fnYwOjgzHzYPNTraGyALiZ4a7c2xNY373AZO7i2oTtgW5vhTWyMNbCL8CmGXQzW-QY-fyanapvPwIlTIdvJIY_B6-LuZb4sVo_3D_PZqqj7L7rCcEUQ05prPsXcMltOjaSaEYeplA6rkmnJSkm5JMJgq9EQBDslMNPc0jHA-711ijkn66o2-Y1KuwqjarCo-mNRr7nYa1qVaxVcUk3t86-QlkwSxnvseo_5pjdjo75iCqbq1C7E9KOh_1_5BrfheBg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces</title><source>Taylor &amp; Francis Journals Complete</source><creator>Tse, M. F.</creator><creatorcontrib>Tse, M. F.</creatorcontrib><description>We have found that the adhesive strength, P, of hot melt adhesives (HMAs) based on semi-crystalline polymers can be described by the following equation: 1 P = P 0 BD previously derived for tack of pressure sensitive adhesives (PSAs). 2,3 In this equation, P 0 is the interfacial adhesion between the adhesive and the substrate, B is the bonding term, and D is the debonding term. This adhesion model is then applied to the development of HMA formulations based on Exxon Chemical's olefinic polymers and Escorez® tackifiers, bonded to Escorene® polypropylene and polyethylene substrate surfaces. Two olefinic polymers, Escorene® EVA polymer (ethylene/vinyl acetate copolymer) and Exact TM polymer, will be used. EVA polymer is the industrial leader in HMA applications, whereas Exact TM polymer is a new family of linear ethylene copolymer products made using a new class of proprietary catalysts. Therefore, performance of HMAs based on EVA polymer and Exact TM polymer is compared in the context of the P 0 , B, and D terms of our adhesion model. The interfacial adhesion P 0 term of these HMAs is generally governed by the surface tensions of the three HMA components: polymer, tackifier and wax. The bonding term, B, depends on the bonding temperature exponentially, and increases with the bonding time to a power of 1/6-1/2 at short bonding time. During the HMA bonding process, the low melt viscosity of the HMA facilitates sufficient spreading on a microscopically rough substrate surface. Therefore, the bonding term B is independent of the bonding pressure. The debonding term, D, depends on adhesive bulk properties. It is related to viscoelastic loss tangent in the industrial peel frequency range when the HMA/substrate assembly exhibits an apparent interfacial failure (AIF) mode, but to the tensile draw ratio at break of the bulk adhesive when the HMA/substrate assembly exhibits a mixed cohesive/apparent interfacial failure (CF/AIF) mode. Overall, compared with HMAs based on EVA polymers, HMAs based on Exact TM polymers show higher viscosity and inferior tensile strength, but better bond strength to polyolefin surfaces, higher strain at break, and lower yield stress.</description><identifier>ISSN: 0021-8464</identifier><identifier>EISSN: 1545-5823</identifier><identifier>EISSN: 1563-518X</identifier><identifier>DOI: 10.1080/00218469508028160</identifier><identifier>CODEN: JADNAJ</identifier><language>eng</language><publisher>Basingstoke: Taylor &amp; Francis Group</publisher><subject>adhesion model ; Application fields ; Applied sciences ; Exact sciences and technology ; hot melt adhesive ; inter-diffusion ; loss tangent ; Polymer industry, paints, wood ; polymers ; polyolefin substrate ; surface tension ; tackifier ; Technology of polymers</subject><ispartof>The Journal of adhesion, 1995-01, Vol.48 (1-4), p.149-167</ispartof><rights>Copyright Taylor &amp; Francis Group, LLC 1995</rights><rights>1995 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c393t-d6a205bb6b6716e5e47d93b52f1399f1a45b954936928d1eb0b0b021fa815b6e3</citedby><cites>FETCH-LOGICAL-c393t-d6a205bb6b6716e5e47d93b52f1399f1a45b954936928d1eb0b0b021fa815b6e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.tandfonline.com/doi/pdf/10.1080/00218469508028160$$EPDF$$P50$$Ginformaworld$$H</linktopdf><linktohtml>$$Uhttps://www.tandfonline.com/doi/full/10.1080/00218469508028160$$EHTML$$P50$$Ginformaworld$$H</linktohtml><link.rule.ids>314,780,784,4024,27923,27924,27925,59647,60436</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=3459256$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Tse, M. F.</creatorcontrib><title>Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces</title><title>The Journal of adhesion</title><description>We have found that the adhesive strength, P, of hot melt adhesives (HMAs) based on semi-crystalline polymers can be described by the following equation: 1 P = P 0 BD previously derived for tack of pressure sensitive adhesives (PSAs). 2,3 In this equation, P 0 is the interfacial adhesion between the adhesive and the substrate, B is the bonding term, and D is the debonding term. This adhesion model is then applied to the development of HMA formulations based on Exxon Chemical's olefinic polymers and Escorez® tackifiers, bonded to Escorene® polypropylene and polyethylene substrate surfaces. Two olefinic polymers, Escorene® EVA polymer (ethylene/vinyl acetate copolymer) and Exact TM polymer, will be used. EVA polymer is the industrial leader in HMA applications, whereas Exact TM polymer is a new family of linear ethylene copolymer products made using a new class of proprietary catalysts. Therefore, performance of HMAs based on EVA polymer and Exact TM polymer is compared in the context of the P 0 , B, and D terms of our adhesion model. The interfacial adhesion P 0 term of these HMAs is generally governed by the surface tensions of the three HMA components: polymer, tackifier and wax. The bonding term, B, depends on the bonding temperature exponentially, and increases with the bonding time to a power of 1/6-1/2 at short bonding time. During the HMA bonding process, the low melt viscosity of the HMA facilitates sufficient spreading on a microscopically rough substrate surface. Therefore, the bonding term B is independent of the bonding pressure. The debonding term, D, depends on adhesive bulk properties. It is related to viscoelastic loss tangent in the industrial peel frequency range when the HMA/substrate assembly exhibits an apparent interfacial failure (AIF) mode, but to the tensile draw ratio at break of the bulk adhesive when the HMA/substrate assembly exhibits a mixed cohesive/apparent interfacial failure (CF/AIF) mode. Overall, compared with HMAs based on EVA polymers, HMAs based on Exact TM polymers show higher viscosity and inferior tensile strength, but better bond strength to polyolefin surfaces, higher strain at break, and lower yield stress.</description><subject>adhesion model</subject><subject>Application fields</subject><subject>Applied sciences</subject><subject>Exact sciences and technology</subject><subject>hot melt adhesive</subject><subject>inter-diffusion</subject><subject>loss tangent</subject><subject>Polymer industry, paints, wood</subject><subject>polymers</subject><subject>polyolefin substrate</subject><subject>surface tension</subject><subject>tackifier</subject><subject>Technology of polymers</subject><issn>0021-8464</issn><issn>1545-5823</issn><issn>1563-518X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1995</creationdate><recordtype>article</recordtype><recordid>eNp1kE1LAzEQhoMoWGp_gLccvK7mY5Mm4KVWa4UWBfUoS7JJNJBulmSt9N-7S6sXkTnMDPO8M8MLwDlGlxgJdIUQwaLkkvUNEZijIzDCrGQFE4Qeg9EwL3qgPAWTnL1GSAhEJaUj8DZr2-Br1fnYwOjgzHzYPNTraGyALiZ4a7c2xNY373AZO7i2oTtgW5vhTWyMNbCL8CmGXQzW-QY-fyanapvPwIlTIdvJIY_B6-LuZb4sVo_3D_PZqqj7L7rCcEUQ05prPsXcMltOjaSaEYeplA6rkmnJSkm5JMJgq9EQBDslMNPc0jHA-711ijkn66o2-Y1KuwqjarCo-mNRr7nYa1qVaxVcUk3t86-QlkwSxnvseo_5pjdjo75iCqbq1C7E9KOh_1_5BrfheBg</recordid><startdate>19950101</startdate><enddate>19950101</enddate><creator>Tse, M. F.</creator><general>Taylor &amp; Francis Group</general><general>Taylor and Francis</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19950101</creationdate><title>Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces</title><author>Tse, M. F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c393t-d6a205bb6b6716e5e47d93b52f1399f1a45b954936928d1eb0b0b021fa815b6e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1995</creationdate><topic>adhesion model</topic><topic>Application fields</topic><topic>Applied sciences</topic><topic>Exact sciences and technology</topic><topic>hot melt adhesive</topic><topic>inter-diffusion</topic><topic>loss tangent</topic><topic>Polymer industry, paints, wood</topic><topic>polymers</topic><topic>polyolefin substrate</topic><topic>surface tension</topic><topic>tackifier</topic><topic>Technology of polymers</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Tse, M. F.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>The Journal of adhesion</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Tse, M. F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces</atitle><jtitle>The Journal of adhesion</jtitle><date>1995-01-01</date><risdate>1995</risdate><volume>48</volume><issue>1-4</issue><spage>149</spage><epage>167</epage><pages>149-167</pages><issn>0021-8464</issn><eissn>1545-5823</eissn><eissn>1563-518X</eissn><coden>JADNAJ</coden><abstract>We have found that the adhesive strength, P, of hot melt adhesives (HMAs) based on semi-crystalline polymers can be described by the following equation: 1 P = P 0 BD previously derived for tack of pressure sensitive adhesives (PSAs). 2,3 In this equation, P 0 is the interfacial adhesion between the adhesive and the substrate, B is the bonding term, and D is the debonding term. This adhesion model is then applied to the development of HMA formulations based on Exxon Chemical's olefinic polymers and Escorez® tackifiers, bonded to Escorene® polypropylene and polyethylene substrate surfaces. Two olefinic polymers, Escorene® EVA polymer (ethylene/vinyl acetate copolymer) and Exact TM polymer, will be used. EVA polymer is the industrial leader in HMA applications, whereas Exact TM polymer is a new family of linear ethylene copolymer products made using a new class of proprietary catalysts. Therefore, performance of HMAs based on EVA polymer and Exact TM polymer is compared in the context of the P 0 , B, and D terms of our adhesion model. The interfacial adhesion P 0 term of these HMAs is generally governed by the surface tensions of the three HMA components: polymer, tackifier and wax. The bonding term, B, depends on the bonding temperature exponentially, and increases with the bonding time to a power of 1/6-1/2 at short bonding time. During the HMA bonding process, the low melt viscosity of the HMA facilitates sufficient spreading on a microscopically rough substrate surface. Therefore, the bonding term B is independent of the bonding pressure. The debonding term, D, depends on adhesive bulk properties. It is related to viscoelastic loss tangent in the industrial peel frequency range when the HMA/substrate assembly exhibits an apparent interfacial failure (AIF) mode, but to the tensile draw ratio at break of the bulk adhesive when the HMA/substrate assembly exhibits a mixed cohesive/apparent interfacial failure (CF/AIF) mode. Overall, compared with HMAs based on EVA polymers, HMAs based on Exact TM polymers show higher viscosity and inferior tensile strength, but better bond strength to polyolefin surfaces, higher strain at break, and lower yield stress.</abstract><cop>Basingstoke</cop><pub>Taylor &amp; Francis Group</pub><doi>10.1080/00218469508028160</doi><tpages>19</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0021-8464
ispartof The Journal of adhesion, 1995-01, Vol.48 (1-4), p.149-167
issn 0021-8464
1545-5823
1563-518X
language eng
recordid cdi_crossref_primary_10_1080_00218469508028160
source Taylor & Francis Journals Complete
subjects adhesion model
Application fields
Applied sciences
Exact sciences and technology
hot melt adhesive
inter-diffusion
loss tangent
Polymer industry, paints, wood
polymers
polyolefin substrate
surface tension
tackifier
Technology of polymers
title Application of Adhesion Model for Developing Hot Melt Adhesives Bonded to Polyolefin Surfaces
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T01%3A02%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Application%20of%20Adhesion%20Model%20for%20Developing%20Hot%20Melt%20Adhesives%20Bonded%20to%20Polyolefin%20Surfaces&rft.jtitle=The%20Journal%20of%20adhesion&rft.au=Tse,%20M.%20F.&rft.date=1995-01-01&rft.volume=48&rft.issue=1-4&rft.spage=149&rft.epage=167&rft.pages=149-167&rft.issn=0021-8464&rft.eissn=1545-5823&rft.coden=JADNAJ&rft_id=info:doi/10.1080/00218469508028160&rft_dat=%3Cpascalfrancis_cross%3E3459256%3C/pascalfrancis_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true