Relaxation kinetics of interface states and bulk traps in atomic layer deposited ZrO2/β-Ga2O3 metal-oxide-semiconductor capacitors

The study of interface states and bulk traps and their connection to device instability is highly demanded to achieve reliable β-Ga2O3 metal-oxide-semiconductor (MOS) devices. However, a comprehensive analysis of the capture/emission behavior of interface states and bulk traps can be challenging due to widespread time constant distribution. In this study, using capacitance transient measurement tools, trap states of the ZrO2/β-Ga2O3 MOS gate stack were explicitly investigated, particularly its bias- and temperature-dependent relaxation kinetics. As forward bias is enlarged, it is observed that the interface state density (Dit) increases by 12.6%. Two bulk traps with discrete levels identified as 0.43 eV (E1) and 0.74 eV (E2) below the conduction band minimum were extracted by deep-level transient spectroscopy. It is further revealed that the emission processes of E1 and E2 are thermally enhanced, while the capture processes remain insensitive to temperature. The electric-field dependence of E1 indicates that the dominant mechanism follows the rule of Poole–Frenkel emission. The capacitance–voltage (C–V) hysteresis deteriorated at a higher forward bias due to the higher trap density and increased population of trapped charges. These findings provide an important framework for future device optimization to improve the reliability and performance of β-Ga2O3 MOS devices.