Direct measurements of thermal transport in glass and ceramic microspheres embedded in an epoxy matrix
The time-domain thermoreflectance metrology is applied to evaluate the thermal conductivities of filler particles embedded in a composite matrix. Specifically, a system of glass and ceramic microspheres with a diameter of 100 to 150 μm embedded in an epoxy matrix was used as a representation of a ty...
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| Veröffentlicht in: | Applied physics letters 2021-07, Vol.119 (2) |
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| container_title | Applied physics letters |
| container_volume | 119 |
| creator | Thompson, Matthew F. Wu, Xuewang Huang, Dingbin Zhang, Yingying Seaton, Nicholas C. A. Zhang, Chi Johnson, Matthew T. Podkaminer, Jacob P. Ho, Victor Wang, Xiaojia |
| description | The time-domain thermoreflectance metrology is applied to evaluate the thermal conductivities of filler particles embedded in a composite matrix. Specifically, a system of glass and ceramic microspheres with a diameter of 100 to 150 μm embedded in an epoxy matrix was used as a representation of a typical composite thermal interface material (TIM) suitable for microelectronics applications. These measurements provide a direct characterization of the thermal properties of filler materials. The measured thermal conductivities of both borosilicate glass and yttria stabilized zirconia microspheres agree well with literature values for bulk materials, whereas the thermal conductivity of the alumina microspheres is nearly 50% lower than that of bulk crystals. The reduction in thermal conductivity of the alumina microspheres highlights how important this level of understanding is for TIM development and is attributed to enhanced phonon scattering due to structural heterogeneity, such as defects induced by phase mixing and microvoids. Combining sample preparation, structural characterization, and direct thermal measurements, our study reveals the structure–thermal property relationship for individual microspheres. The results of this work can facilitate the design and engineering of composite-based thermally conductive materials for thermal management applications. |
| doi_str_mv | 10.1063/5.0055038 |
| format | Article |
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A. ; Zhang, Chi ; Johnson, Matthew T. ; Podkaminer, Jacob P. ; Ho, Victor ; Wang, Xiaojia</creator><creatorcontrib>Thompson, Matthew F. ; Wu, Xuewang ; Huang, Dingbin ; Zhang, Yingying ; Seaton, Nicholas C. A. ; Zhang, Chi ; Johnson, Matthew T. ; Podkaminer, Jacob P. ; Ho, Victor ; Wang, Xiaojia</creatorcontrib><description>The time-domain thermoreflectance metrology is applied to evaluate the thermal conductivities of filler particles embedded in a composite matrix. Specifically, a system of glass and ceramic microspheres with a diameter of 100 to 150 μm embedded in an epoxy matrix was used as a representation of a typical composite thermal interface material (TIM) suitable for microelectronics applications. These measurements provide a direct characterization of the thermal properties of filler materials. The measured thermal conductivities of both borosilicate glass and yttria stabilized zirconia microspheres agree well with literature values for bulk materials, whereas the thermal conductivity of the alumina microspheres is nearly 50% lower than that of bulk crystals. The reduction in thermal conductivity of the alumina microspheres highlights how important this level of understanding is for TIM development and is attributed to enhanced phonon scattering due to structural heterogeneity, such as defects induced by phase mixing and microvoids. Combining sample preparation, structural characterization, and direct thermal measurements, our study reveals the structure–thermal property relationship for individual microspheres. The results of this work can facilitate the design and engineering of composite-based thermally conductive materials for thermal management applications.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/5.0055038</identifier><identifier>CODEN: APPLAB</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Aluminum oxide ; Applied physics ; Borosilicate glass ; Crystal defects ; Diameters ; Fillers ; Heat conductivity ; Heat transfer ; Heterogeneity ; Microspheres ; Particulate composites ; Structural analysis ; Thermal conductivity ; Thermal management ; Thermal measurement ; Thermodynamic properties ; Yttria-stabilized zirconia ; Yttrium oxide ; Zirconium dioxide</subject><ispartof>Applied physics letters, 2021-07, Vol.119 (2)</ispartof><rights>Author(s)</rights><rights>2021 Author(s). Published under an exclusive license by AIP Publishing.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c322t-6beded3b4b97582326036296c9cb5781c6f661e5b44f649e99b13d9b9ef0e1f73</cites><orcidid>0000-0001-7612-1739 ; 0000-0002-3710-1070 ; 0000-0001-8648-9801</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/apl/article-lookup/doi/10.1063/5.0055038$$EHTML$$P50$$Gscitation$$H</linktohtml><link.rule.ids>314,780,784,794,4510,27923,27924,76155</link.rule.ids></links><search><creatorcontrib>Thompson, Matthew F.</creatorcontrib><creatorcontrib>Wu, Xuewang</creatorcontrib><creatorcontrib>Huang, Dingbin</creatorcontrib><creatorcontrib>Zhang, Yingying</creatorcontrib><creatorcontrib>Seaton, Nicholas C. A.</creatorcontrib><creatorcontrib>Zhang, Chi</creatorcontrib><creatorcontrib>Johnson, Matthew T.</creatorcontrib><creatorcontrib>Podkaminer, Jacob P.</creatorcontrib><creatorcontrib>Ho, Victor</creatorcontrib><creatorcontrib>Wang, Xiaojia</creatorcontrib><title>Direct measurements of thermal transport in glass and ceramic microspheres embedded in an epoxy matrix</title><title>Applied physics letters</title><description>The time-domain thermoreflectance metrology is applied to evaluate the thermal conductivities of filler particles embedded in a composite matrix. Specifically, a system of glass and ceramic microspheres with a diameter of 100 to 150 μm embedded in an epoxy matrix was used as a representation of a typical composite thermal interface material (TIM) suitable for microelectronics applications. These measurements provide a direct characterization of the thermal properties of filler materials. The measured thermal conductivities of both borosilicate glass and yttria stabilized zirconia microspheres agree well with literature values for bulk materials, whereas the thermal conductivity of the alumina microspheres is nearly 50% lower than that of bulk crystals. The reduction in thermal conductivity of the alumina microspheres highlights how important this level of understanding is for TIM development and is attributed to enhanced phonon scattering due to structural heterogeneity, such as defects induced by phase mixing and microvoids. Combining sample preparation, structural characterization, and direct thermal measurements, our study reveals the structure–thermal property relationship for individual microspheres. The results of this work can facilitate the design and engineering of composite-based thermally conductive materials for thermal management applications.</description><subject>Aluminum oxide</subject><subject>Applied physics</subject><subject>Borosilicate glass</subject><subject>Crystal defects</subject><subject>Diameters</subject><subject>Fillers</subject><subject>Heat conductivity</subject><subject>Heat transfer</subject><subject>Heterogeneity</subject><subject>Microspheres</subject><subject>Particulate composites</subject><subject>Structural analysis</subject><subject>Thermal conductivity</subject><subject>Thermal management</subject><subject>Thermal measurement</subject><subject>Thermodynamic properties</subject><subject>Yttria-stabilized zirconia</subject><subject>Yttrium oxide</subject><subject>Zirconium dioxide</subject><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNqd0E1LAzEQBuAgCtbqwX8Q8KSwNdnZZDdHqfUDCl70HLLZiW7pbtYklfbfu6UF7x6GYeBhZngJueZsxpmEezFjTAgG1QmZcFaWGXBenZIJYwwyqQQ_JxcxrsZR5AAT4h7bgDbRDk3cBOywT5F6R9MXhs6saQqmj4MPibY9_VybGKnpG2oxmK61dKzg4zBijBS7GpsGmz01PcXBb3e0Mym020ty5sw64tWxT8nH0-J9_pIt355f5w_LzEKep0yOC7CBuqhVKaoccslA5kpaZWtRVtxKJyVHUReFk4VCpWoOjaoVOobclTAlN4e9Q_DfG4xJr_wm9ONJnQvBoQJVVqO6Paj98zGg00NoOxN2mjO9j1ELfYxxtHcHG22bTGp9_z_848Mf1EPj4BdndoFr</recordid><startdate>20210712</startdate><enddate>20210712</enddate><creator>Thompson, Matthew F.</creator><creator>Wu, Xuewang</creator><creator>Huang, Dingbin</creator><creator>Zhang, Yingying</creator><creator>Seaton, Nicholas C. 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These measurements provide a direct characterization of the thermal properties of filler materials. The measured thermal conductivities of both borosilicate glass and yttria stabilized zirconia microspheres agree well with literature values for bulk materials, whereas the thermal conductivity of the alumina microspheres is nearly 50% lower than that of bulk crystals. The reduction in thermal conductivity of the alumina microspheres highlights how important this level of understanding is for TIM development and is attributed to enhanced phonon scattering due to structural heterogeneity, such as defects induced by phase mixing and microvoids. Combining sample preparation, structural characterization, and direct thermal measurements, our study reveals the structure–thermal property relationship for individual microspheres. 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| ispartof | Applied physics letters, 2021-07, Vol.119 (2) |
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| source | AIP Journals Complete; Alma/SFX Local Collection |
| subjects | Aluminum oxide Applied physics Borosilicate glass Crystal defects Diameters Fillers Heat conductivity Heat transfer Heterogeneity Microspheres Particulate composites Structural analysis Thermal conductivity Thermal management Thermal measurement Thermodynamic properties Yttria-stabilized zirconia Yttrium oxide Zirconium dioxide |
| title | Direct measurements of thermal transport in glass and ceramic microspheres embedded in an epoxy matrix |
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