Influence of helium I layer formation on the copper-helium-4 Kapitza resistance at helium II bath temperatures

The transient Kapitza resistance between copper and helium II caused by a step input in power has been studied near 2 K. The resistance is affected by formation of a helium I layer whose thickness, of the order 10−4–10−5 cm, is evaluated as a function of the heat flux density.

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Veröffentlicht in:Appl. Phys. Lett.; (United States) 1983-09, Vol.43 (5), p.451-453
Hauptverfasser: KIM, Y. I, LI-HE LIN, CHUANG, C, FREDERKING, T. H. K
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Sprache:eng
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Zusammenfassung:The transient Kapitza resistance between copper and helium II caused by a step input in power has been studied near 2 K. The resistance is affected by formation of a helium I layer whose thickness, of the order 10−4–10−5 cm, is evaluated as a function of the heat flux density.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.94385