Black silicon morphologies using conventional RIE processing
We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various...
Gespeichert in:
Veröffentlicht in: | AIP advances 2017-05, Vol.7 (5), p.055115-055115-7 |
---|---|
Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 055115-7 |
---|---|
container_issue | 5 |
container_start_page | 055115 |
container_title | AIP advances |
container_volume | 7 |
creator | Chowdhury, Zahidur R. Loh, Joel Y. Y. Pishon, Md. Nishanto Nahid Kherani, Nazir P. |
description | We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various run times. Low pressure RIE conditions yield tapered profiles while at higher pressures nano-pillars are produced. The optimized condition of 650 mTorr for 20-30 minutes yields uniform distribution of nano dendritic pillars resulting in a low average reflectance of 4.2% – without an additional antireflective coating. A simple kinetic Monte-Carlo model shows that nano-dendritic structures can be formed due to low etching rate of side walls and evolve into tapered structures over a longer run time. Refractive index profiles built from our simulated patterns and surface morphology of the samples yield calculated reflectance curves that correlate well with experimental results. |
doi_str_mv | 10.1063/1.4984215 |
format | Article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1063_1_4984215</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><doaj_id>oai_doaj_org_article_714492143d404a8d917d240eece04eaf</doaj_id><sourcerecordid>2124495423</sourcerecordid><originalsourceid>FETCH-LOGICAL-c393t-6d84854e5b52af1a24bda4b0ed5240de40f65403c9545ed98326e456ff06e01d3</originalsourceid><addsrcrecordid>eNp9kE9LAzEQxYMoWGoPfoMFTwpb82ey3QUvWqoWCoLoOaTJbE3dbmqyFfz2pm4RT84hEya_vOE9Qs4ZHTNaiGs2hqoEzuQRGaSzzAXnxfGf-ykZxbimqaBitIQBublrtHnPomuc8W228WH75hu_chizXXTtKkvjT2w751vdZM_zWbYN3mDcv52Rk1o3EUeHPiSv97OX6WO-eHqYT28XuRGV6PLCllBKQLmUXNdMc1haDUuKVnKgFoHWhQQqTCVBoq1KwQsEWdQ1LZAyK4Zk3utar9dqG9xGhy_ltVM_Ax9WSofOmQbVhAFUnIGwQEGXtmITm5YgGqSAuk5aF71WsvGxw9iptd-F5C0qznj6LIGLRF32lAk-xoD171ZG1T5rxdQh68Re9Ww0rtP7oP6BvwH5cnvq</addsrcrecordid><sourcetype>Open Website</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2124495423</pqid></control><display><type>article</type><title>Black silicon morphologies using conventional RIE processing</title><source>DOAJ Directory of Open Access Journals</source><source>Alma/SFX Local Collection</source><source>Free Full-Text Journals in Chemistry</source><source>EZB Electronic Journals Library</source><creator>Chowdhury, Zahidur R. ; Loh, Joel Y. Y. ; Pishon, Md. Nishanto Nahid ; Kherani, Nazir P.</creator><creatorcontrib>Chowdhury, Zahidur R. ; Loh, Joel Y. Y. ; Pishon, Md. Nishanto Nahid ; Kherani, Nazir P.</creatorcontrib><description>We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various run times. Low pressure RIE conditions yield tapered profiles while at higher pressures nano-pillars are produced. The optimized condition of 650 mTorr for 20-30 minutes yields uniform distribution of nano dendritic pillars resulting in a low average reflectance of 4.2% – without an additional antireflective coating. A simple kinetic Monte-Carlo model shows that nano-dendritic structures can be formed due to low etching rate of side walls and evolve into tapered structures over a longer run time. Refractive index profiles built from our simulated patterns and surface morphology of the samples yield calculated reflectance curves that correlate well with experimental results.</description><identifier>ISSN: 2158-3226</identifier><identifier>EISSN: 2158-3226</identifier><identifier>DOI: 10.1063/1.4984215</identifier><identifier>CODEN: AAIDBI</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Antireflection coatings ; Computer simulation ; Dendritic structure ; Ion etching ; Low pressure ; Monte Carlo simulation ; Morphology ; Optical reflection ; Pillars ; Reactive ion etching ; Reflectance ; Reflectance curves ; Refractivity ; Silicon ; Silicon wafers</subject><ispartof>AIP advances, 2017-05, Vol.7 (5), p.055115-055115-7</ispartof><rights>Author(s)</rights><rights>2017 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c393t-6d84854e5b52af1a24bda4b0ed5240de40f65403c9545ed98326e456ff06e01d3</citedby><cites>FETCH-LOGICAL-c393t-6d84854e5b52af1a24bda4b0ed5240de40f65403c9545ed98326e456ff06e01d3</cites><orcidid>0000-0002-5966-7593</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,860,2096,27901,27902</link.rule.ids></links><search><creatorcontrib>Chowdhury, Zahidur R.</creatorcontrib><creatorcontrib>Loh, Joel Y. Y.</creatorcontrib><creatorcontrib>Pishon, Md. Nishanto Nahid</creatorcontrib><creatorcontrib>Kherani, Nazir P.</creatorcontrib><title>Black silicon morphologies using conventional RIE processing</title><title>AIP advances</title><description>We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various run times. Low pressure RIE conditions yield tapered profiles while at higher pressures nano-pillars are produced. The optimized condition of 650 mTorr for 20-30 minutes yields uniform distribution of nano dendritic pillars resulting in a low average reflectance of 4.2% – without an additional antireflective coating. A simple kinetic Monte-Carlo model shows that nano-dendritic structures can be formed due to low etching rate of side walls and evolve into tapered structures over a longer run time. Refractive index profiles built from our simulated patterns and surface morphology of the samples yield calculated reflectance curves that correlate well with experimental results.</description><subject>Antireflection coatings</subject><subject>Computer simulation</subject><subject>Dendritic structure</subject><subject>Ion etching</subject><subject>Low pressure</subject><subject>Monte Carlo simulation</subject><subject>Morphology</subject><subject>Optical reflection</subject><subject>Pillars</subject><subject>Reactive ion etching</subject><subject>Reflectance</subject><subject>Reflectance curves</subject><subject>Refractivity</subject><subject>Silicon</subject><subject>Silicon wafers</subject><issn>2158-3226</issn><issn>2158-3226</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>DOA</sourceid><recordid>eNp9kE9LAzEQxYMoWGoPfoMFTwpb82ey3QUvWqoWCoLoOaTJbE3dbmqyFfz2pm4RT84hEya_vOE9Qs4ZHTNaiGs2hqoEzuQRGaSzzAXnxfGf-ykZxbimqaBitIQBublrtHnPomuc8W228WH75hu_chizXXTtKkvjT2w751vdZM_zWbYN3mDcv52Rk1o3EUeHPiSv97OX6WO-eHqYT28XuRGV6PLCllBKQLmUXNdMc1haDUuKVnKgFoHWhQQqTCVBoq1KwQsEWdQ1LZAyK4Zk3utar9dqG9xGhy_ltVM_Ax9WSofOmQbVhAFUnIGwQEGXtmITm5YgGqSAuk5aF71WsvGxw9iptd-F5C0qznj6LIGLRF32lAk-xoD171ZG1T5rxdQh68Re9Ww0rtP7oP6BvwH5cnvq</recordid><startdate>201705</startdate><enddate>201705</enddate><creator>Chowdhury, Zahidur R.</creator><creator>Loh, Joel Y. Y.</creator><creator>Pishon, Md. Nishanto Nahid</creator><creator>Kherani, Nazir P.</creator><general>American Institute of Physics</general><general>AIP Publishing LLC</general><scope>AJDQP</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>DOA</scope><orcidid>https://orcid.org/0000-0002-5966-7593</orcidid></search><sort><creationdate>201705</creationdate><title>Black silicon morphologies using conventional RIE processing</title><author>Chowdhury, Zahidur R. ; Loh, Joel Y. Y. ; Pishon, Md. Nishanto Nahid ; Kherani, Nazir P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c393t-6d84854e5b52af1a24bda4b0ed5240de40f65403c9545ed98326e456ff06e01d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Antireflection coatings</topic><topic>Computer simulation</topic><topic>Dendritic structure</topic><topic>Ion etching</topic><topic>Low pressure</topic><topic>Monte Carlo simulation</topic><topic>Morphology</topic><topic>Optical reflection</topic><topic>Pillars</topic><topic>Reactive ion etching</topic><topic>Reflectance</topic><topic>Reflectance curves</topic><topic>Refractivity</topic><topic>Silicon</topic><topic>Silicon wafers</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chowdhury, Zahidur R.</creatorcontrib><creatorcontrib>Loh, Joel Y. Y.</creatorcontrib><creatorcontrib>Pishon, Md. Nishanto Nahid</creatorcontrib><creatorcontrib>Kherani, Nazir P.</creatorcontrib><collection>AIP Open Access Journals</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>DOAJ Directory of Open Access Journals</collection><jtitle>AIP advances</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chowdhury, Zahidur R.</au><au>Loh, Joel Y. Y.</au><au>Pishon, Md. Nishanto Nahid</au><au>Kherani, Nazir P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Black silicon morphologies using conventional RIE processing</atitle><jtitle>AIP advances</jtitle><date>2017-05</date><risdate>2017</risdate><volume>7</volume><issue>5</issue><spage>055115</spage><epage>055115-7</epage><pages>055115-055115-7</pages><issn>2158-3226</issn><eissn>2158-3226</eissn><coden>AAIDBI</coden><abstract>We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various run times. Low pressure RIE conditions yield tapered profiles while at higher pressures nano-pillars are produced. The optimized condition of 650 mTorr for 20-30 minutes yields uniform distribution of nano dendritic pillars resulting in a low average reflectance of 4.2% – without an additional antireflective coating. A simple kinetic Monte-Carlo model shows that nano-dendritic structures can be formed due to low etching rate of side walls and evolve into tapered structures over a longer run time. Refractive index profiles built from our simulated patterns and surface morphology of the samples yield calculated reflectance curves that correlate well with experimental results.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.4984215</doi><tpages>7</tpages><orcidid>https://orcid.org/0000-0002-5966-7593</orcidid><oa>free_for_read</oa></addata></record> |
fulltext | fulltext |
identifier | ISSN: 2158-3226 |
ispartof | AIP advances, 2017-05, Vol.7 (5), p.055115-055115-7 |
issn | 2158-3226 2158-3226 |
language | eng |
recordid | cdi_crossref_primary_10_1063_1_4984215 |
source | DOAJ Directory of Open Access Journals; Alma/SFX Local Collection; Free Full-Text Journals in Chemistry; EZB Electronic Journals Library |
subjects | Antireflection coatings Computer simulation Dendritic structure Ion etching Low pressure Monte Carlo simulation Morphology Optical reflection Pillars Reactive ion etching Reflectance Reflectance curves Refractivity Silicon Silicon wafers |
title | Black silicon morphologies using conventional RIE processing |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T18%3A51%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Black%20silicon%20morphologies%20using%20conventional%20RIE%20processing&rft.jtitle=AIP%20advances&rft.au=Chowdhury,%20Zahidur%20R.&rft.date=2017-05&rft.volume=7&rft.issue=5&rft.spage=055115&rft.epage=055115-7&rft.pages=055115-055115-7&rft.issn=2158-3226&rft.eissn=2158-3226&rft.coden=AAIDBI&rft_id=info:doi/10.1063/1.4984215&rft_dat=%3Cproquest_cross%3E2124495423%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2124495423&rft_id=info:pmid/&rft_doaj_id=oai_doaj_org_article_714492143d404a8d917d240eece04eaf&rfr_iscdi=true |