Black silicon morphologies using conventional RIE processing

We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various...

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Veröffentlicht in:AIP advances 2017-05, Vol.7 (5), p.055115-055115-7
Hauptverfasser: Chowdhury, Zahidur R., Loh, Joel Y. Y., Pishon, Md. Nishanto Nahid, Kherani, Nazir P.
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container_end_page 055115-7
container_issue 5
container_start_page 055115
container_title AIP advances
container_volume 7
creator Chowdhury, Zahidur R.
Loh, Joel Y. Y.
Pishon, Md. Nishanto Nahid
Kherani, Nazir P.
description We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over a pressure range of 550 - 700 mTorr at various run times. Low pressure RIE conditions yield tapered profiles while at higher pressures nano-pillars are produced. The optimized condition of 650 mTorr for 20-30 minutes yields uniform distribution of nano dendritic pillars resulting in a low average reflectance of 4.2% – without an additional antireflective coating. A simple kinetic Monte-Carlo model shows that nano-dendritic structures can be formed due to low etching rate of side walls and evolve into tapered structures over a longer run time. Refractive index profiles built from our simulated patterns and surface morphology of the samples yield calculated reflectance curves that correlate well with experimental results.
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subjects Antireflection coatings
Computer simulation
Dendritic structure
Ion etching
Low pressure
Monte Carlo simulation
Morphology
Optical reflection
Pillars
Reactive ion etching
Reflectance
Reflectance curves
Refractivity
Silicon
Silicon wafers
title Black silicon morphologies using conventional RIE processing
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