Disorder-free sputtering method on graphene

Deposition of various materials onto graphene without causing any disorder is highly desirable for graphene applications. Especially, sputtering is a versatile technique to deposit various metals and insulators for spintronics, and indium tin oxide to make transparent devices. However, the sputterin...

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Veröffentlicht in:AIP advances 2012-09, Vol.2 (3), p.032121-032121-6
Hauptverfasser: Qiu, Xue Peng, Shin, Young Jun, Niu, Jing, Kulothungasagaran, Narayanapillai, Kalon, Gopinadhan, Qiu, Caiyu, Yu, Ting, Yang, Hyunsoo
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container_start_page 032121
container_title AIP advances
container_volume 2
creator Qiu, Xue Peng
Shin, Young Jun
Niu, Jing
Kulothungasagaran, Narayanapillai
Kalon, Gopinadhan
Qiu, Caiyu
Yu, Ting
Yang, Hyunsoo
description Deposition of various materials onto graphene without causing any disorder is highly desirable for graphene applications. Especially, sputtering is a versatile technique to deposit various metals and insulators for spintronics, and indium tin oxide to make transparent devices. However, the sputtering process causes damage to graphene because of high energy sputtered atoms. By flipping the substrate and using a high Ar pressure, we demonstrate that the level of damage to graphene can be reduced or eliminated in dc, rf, and reactive sputtering processes.
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subjects Damage
DEPOSITION
DEPOSITS
Devices
Disorders
GRAPHENE
INDIUM
Indium tin oxide
Insulators
MATERIALS SCIENCE
NANOSCIENCE AND NANOTECHNOLOGY
SPUTTERING
SUBSTRATES
TIN OXIDES
title Disorder-free sputtering method on graphene
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