Deformation mechanism in the forcefill process

Forcefill is a method used in metallization of ICs to fill via holes with metal. At elevated temperature and under applied pressure the metal flows into the via hole. The method is applicable to aluminum as well as to copper. In this article the mechanism of the process is discussed based on measure...

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Veröffentlicht in:	Journal of applied physics 2000-01, Vol.87 (2), p.889-892
Hauptverfasser:	Janssen, G. C. A. M., Jongste, J. F., Verbruggen, A. H.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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