Effect of high-pressure oxygen annealing on negative bias illumination stress-induced instability of InGaZnO thin film transistors

Negative-bias illumination stress (NBIS) of amorphous InGaZnO (IGZO) transistors can cause a large negative shift ( > 7.1   V ) in threshold voltage, something frequently attributed to the trapping of photoinduced hole carriers. This work demonstrates that the deterioration of threshold voltage b...

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Veröffentlicht in:Applied physics letters 2011-03, Vol.98 (10), p.103509-103509-3
Hauptverfasser: Ji, Kwang Hwan, Kim, Ji-In, Jung, Hong Yoon, Park, Se Yeob, Choi, Rino, Kim, Un Ki, Hwang, Cheol Seong, Lee, Daeseok, Hwang, Hyungsang, Jeong, Jae Kyeong
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container_issue 10
container_start_page 103509
container_title Applied physics letters
container_volume 98
creator Ji, Kwang Hwan
Kim, Ji-In
Jung, Hong Yoon
Park, Se Yeob
Choi, Rino
Kim, Un Ki
Hwang, Cheol Seong
Lee, Daeseok
Hwang, Hyungsang
Jeong, Jae Kyeong
description Negative-bias illumination stress (NBIS) of amorphous InGaZnO (IGZO) transistors can cause a large negative shift ( > 7.1   V ) in threshold voltage, something frequently attributed to the trapping of photoinduced hole carriers. This work demonstrates that the deterioration of threshold voltage by NBIS can be strongly suppressed by high-pressure annealing under 10 atm O 2 ambient. This improvement occurred through a reduction in oxygen vacancy defects in the IGZO film, indicating that a photoinduced transition from V O to V O 2 + was responsible for the NBIS-induced instability.
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title Effect of high-pressure oxygen annealing on negative bias illumination stress-induced instability of InGaZnO thin film transistors
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