Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films

Titanium silicon multilayers have been produced by alternating sputter deposition. The stress in the as-deposited layers is a function of the period of the multilayer structure. The multilayers were subsequently annealed to form silicide films. From stress and strain measurements on these films Pois...

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Veröffentlicht in:Journal of applied physics 1988-05, Vol.63 (10), p.4979-4982
Hauptverfasser: WESSELS, P. J. J, JONGSTE, J. F, JANSSEN, G. C. A. M, MULDER, A. L, RADELAAR, S, LOOPSTRA, O. B
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container_end_page 4982
container_issue 10
container_start_page 4979
container_title Journal of applied physics
container_volume 63
creator WESSELS, P. J. J
JONGSTE, J. F
JANSSEN, G. C. A. M
MULDER, A. L
RADELAAR, S
LOOPSTRA, O. B
description Titanium silicon multilayers have been produced by alternating sputter deposition. The stress in the as-deposited layers is a function of the period of the multilayer structure. The multilayers were subsequently annealed to form silicide films. From stress and strain measurements on these films Poisson’s ratio is determined. After annealing, the films exhibit a tensile stress which can be attributed to the difference in thermal expansion coefficient between substrate and silicide film.
doi_str_mv 10.1063/1.340443
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fullrecord <record><control><sourceid>pascalfrancis_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1063_1_340443</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>7217068</sourcerecordid><originalsourceid>FETCH-LOGICAL-c320t-f886976550eb23631fbcc507bd232016c89c06fa04f5a99febbbab190d4bd0973</originalsourceid><addsrcrecordid>eNo9kEtLAzEUhYMoWKvgT8jChZup905m8liK-KTgonU9JJkEIul0yJ0u5t9bqbg6i_NxOHyM3SKsEKR4wJVooGnEGVsgaFOptoVztgCosdJGmUt2RfQNgKiFWbCPzVQCUSCeBk7jYZpCCT3fpmqT-O6Qp5TtHApxO_R83OfZl5kmm3MaAqeUk0994DHlHV2zi2gzhZu_XLKvl-ft01u1_nx9f3pcV17UMFVRa2mUPN4KrhZSYHTet6BcXx97lF4bDzJaaGJrjYnBOWcdGugb14NRYsnuT7u-7IlKiN1Y0s6WuUPofh102J0cHNG7Ezpa8jbHYgef6J9XNSqQWvwAjgZbnw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films</title><source>AIP Digital Archive</source><creator>WESSELS, P. J. J ; JONGSTE, J. F ; JANSSEN, G. C. A. M ; MULDER, A. L ; RADELAAR, S ; LOOPSTRA, O. B</creator><creatorcontrib>WESSELS, P. J. J ; JONGSTE, J. F ; JANSSEN, G. C. A. M ; MULDER, A. L ; RADELAAR, S ; LOOPSTRA, O. B</creatorcontrib><description>Titanium silicon multilayers have been produced by alternating sputter deposition. The stress in the as-deposited layers is a function of the period of the multilayer structure. The multilayers were subsequently annealed to form silicide films. From stress and strain measurements on these films Poisson’s ratio is determined. After annealing, the films exhibit a tensile stress which can be attributed to the difference in thermal expansion coefficient between substrate and silicide film.</description><identifier>ISSN: 0021-8979</identifier><identifier>EISSN: 1089-7550</identifier><identifier>DOI: 10.1063/1.340443</identifier><identifier>CODEN: JAPIAU</identifier><language>eng</language><publisher>Woodbury, NY: American Institute of Physics</publisher><subject>Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties ; Physics ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Journal of applied physics, 1988-05, Vol.63 (10), p.4979-4982</ispartof><rights>1989 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c320t-f886976550eb23631fbcc507bd232016c89c06fa04f5a99febbbab190d4bd0973</citedby><cites>FETCH-LOGICAL-c320t-f886976550eb23631fbcc507bd232016c89c06fa04f5a99febbbab190d4bd0973</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=7217068$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>WESSELS, P. J. J</creatorcontrib><creatorcontrib>JONGSTE, J. F</creatorcontrib><creatorcontrib>JANSSEN, G. C. A. M</creatorcontrib><creatorcontrib>MULDER, A. L</creatorcontrib><creatorcontrib>RADELAAR, S</creatorcontrib><creatorcontrib>LOOPSTRA, O. B</creatorcontrib><title>Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films</title><title>Journal of applied physics</title><description>Titanium silicon multilayers have been produced by alternating sputter deposition. The stress in the as-deposited layers is a function of the period of the multilayer structure. The multilayers were subsequently annealed to form silicide films. From stress and strain measurements on these films Poisson’s ratio is determined. After annealing, the films exhibit a tensile stress which can be attributed to the difference in thermal expansion coefficient between substrate and silicide film.</description><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties</subject><subject>Physics</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0021-8979</issn><issn>1089-7550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1988</creationdate><recordtype>article</recordtype><recordid>eNo9kEtLAzEUhYMoWKvgT8jChZup905m8liK-KTgonU9JJkEIul0yJ0u5t9bqbg6i_NxOHyM3SKsEKR4wJVooGnEGVsgaFOptoVztgCosdJGmUt2RfQNgKiFWbCPzVQCUSCeBk7jYZpCCT3fpmqT-O6Qp5TtHApxO_R83OfZl5kmm3MaAqeUk0994DHlHV2zi2gzhZu_XLKvl-ft01u1_nx9f3pcV17UMFVRa2mUPN4KrhZSYHTet6BcXx97lF4bDzJaaGJrjYnBOWcdGugb14NRYsnuT7u-7IlKiN1Y0s6WuUPofh102J0cHNG7Ezpa8jbHYgef6J9XNSqQWvwAjgZbnw</recordid><startdate>19880515</startdate><enddate>19880515</enddate><creator>WESSELS, P. J. J</creator><creator>JONGSTE, J. F</creator><creator>JANSSEN, G. C. A. M</creator><creator>MULDER, A. L</creator><creator>RADELAAR, S</creator><creator>LOOPSTRA, O. B</creator><general>American Institute of Physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19880515</creationdate><title>Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films</title><author>WESSELS, P. J. J ; JONGSTE, J. F ; JANSSEN, G. C. A. M ; MULDER, A. L ; RADELAAR, S ; LOOPSTRA, O. B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c320t-f886976550eb23631fbcc507bd232016c89c06fa04f5a99febbbab190d4bd0973</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1988</creationdate><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties</topic><topic>Physics</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>WESSELS, P. J. J</creatorcontrib><creatorcontrib>JONGSTE, J. F</creatorcontrib><creatorcontrib>JANSSEN, G. C. A. M</creatorcontrib><creatorcontrib>MULDER, A. L</creatorcontrib><creatorcontrib>RADELAAR, S</creatorcontrib><creatorcontrib>LOOPSTRA, O. B</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Journal of applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>WESSELS, P. J. J</au><au>JONGSTE, J. F</au><au>JANSSEN, G. C. A. M</au><au>MULDER, A. L</au><au>RADELAAR, S</au><au>LOOPSTRA, O. B</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films</atitle><jtitle>Journal of applied physics</jtitle><date>1988-05-15</date><risdate>1988</risdate><volume>63</volume><issue>10</issue><spage>4979</spage><epage>4982</epage><pages>4979-4982</pages><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>Titanium silicon multilayers have been produced by alternating sputter deposition. The stress in the as-deposited layers is a function of the period of the multilayer structure. The multilayers were subsequently annealed to form silicide films. From stress and strain measurements on these films Poisson’s ratio is determined. After annealing, the films exhibit a tensile stress which can be attributed to the difference in thermal expansion coefficient between substrate and silicide film.</abstract><cop>Woodbury, NY</cop><pub>American Institute of Physics</pub><doi>10.1063/1.340443</doi><tpages>4</tpages></addata></record>
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1089-7550
language eng
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subjects Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
title Stresses in sputtered Ti-Si multilayers and polycrystalline silicide films
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T20%3A40%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Stresses%20in%20sputtered%20Ti-Si%20multilayers%20and%20polycrystalline%20silicide%20films&rft.jtitle=Journal%20of%20applied%20physics&rft.au=WESSELS,%20P.%20J.%20J&rft.date=1988-05-15&rft.volume=63&rft.issue=10&rft.spage=4979&rft.epage=4982&rft.pages=4979-4982&rft.issn=0021-8979&rft.eissn=1089-7550&rft.coden=JAPIAU&rft_id=info:doi/10.1063/1.340443&rft_dat=%3Cpascalfrancis_cross%3E7217068%3C/pascalfrancis_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true