Catalyzed gaseous etching of silicon

Traces of copper and silver are shown to accelerate the etching of silicon by molecular fluorine. Copper residue formed by aqueous HF etching of sputter-deposited aluminum (0.5% Cu) produces a 100-fold increase in the etching rate of an underlying (100) silicon, compared to unmetallized samples, at...

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Veröffentlicht in:	Journal of applied physics 1987-08, Vol.62 (3), p.1049-1053
Hauptverfasser:	NUR SELAMOGLU, MUCHA, J. A, FLAMM, D. L, IBBOTSON, D. E
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Physics Solid-fluid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
Online-Zugang:	Volltext
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