Damage induced in Si by ion milling or reactive ion etching
Surface damage in Si substrates created by Ar-ion milling or by reactive-ion etching in CF4, CHF3, Cl2, SiCl4, or SiF4 has been investigated. Metal-oxide-semiconductor capacitors were fabricated on the etched Si substrates, and the interface-state densities were obtained from capacitance-voltage mea...
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Veröffentlicht in: | Journal of applied physics 1983-06, Vol.54 (6), p.3272-3277 |
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Format: | Artikel |
Sprache: | eng |
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