{110}-facets formation by hydrogen thermal etching on sidewalls of Si and strained-Si fin structures

Si-fin structures for multigate metal-oxide-semiconductor field effect transistors (MOSFETs) with smooth and vertical sidewalls composed of {110} facets were obtained by an anisotropic gas etching in atmospheric hydrogen ambient at 925–1000°C on strained and unstrained (001) Si-on-insulator (SOI) su...

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Veröffentlicht in:Applied physics letters 2008-05, Vol.92 (19)
Hauptverfasser: Tezuka, Tsutomu, Hirashita, Norio, Moriyama, Yoshihiko, Sugiyama, Naoharu, Usuda, Koji, Toyoda, Eiji, Murayama, Ken, Takagi, Shin-ichi
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container_issue 19
container_start_page
container_title Applied physics letters
container_volume 92
creator Tezuka, Tsutomu
Hirashita, Norio
Moriyama, Yoshihiko
Sugiyama, Naoharu
Usuda, Koji
Toyoda, Eiji
Murayama, Ken
Takagi, Shin-ichi
description Si-fin structures for multigate metal-oxide-semiconductor field effect transistors (MOSFETs) with smooth and vertical sidewalls composed of {110} facets were obtained by an anisotropic gas etching in atmospheric hydrogen ambient at 925–1000°C on strained and unstrained (001) Si-on-insulator (SOI) substrates. {110} facets emerged due to higher etching rate for higher-order crystalline plane adjacent to {110} planes. The facet formation effectively eliminated the fin-width variation originating from the lithography process. The uniaxial stress along the fins on the strained SOI substrate was found to be preserved during the process, indicating the availability of this technique for fabrication of multigate MOSFETs with strained-fin channels.
doi_str_mv 10.1063/1.2924281
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title {110}-facets formation by hydrogen thermal etching on sidewalls of Si and strained-Si fin structures
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