Effects of active atomic sinks and reservoirs on the reliability of Cu ∕ low - k interconnects

Electromigration experiments using Cu ∕ low - k interconnect tree structures were carried out in order to study the effects of active atomic sinks and reservoirs on interconnect reliability. In all cases, failures occurred after a long period of void growth. Kinetic parameters were extracted from re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of applied physics 2008-04, Vol.103 (8), p.084513-084513-11
Hauptverfasser:	Wei, Frank L., Hau-Riege, Christine S., Marathe, Amit P., Thompson, Carl V.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!