Damage-free electrodes fabrication for top emitting organic light emitting diodes by transfer fabrication

We report a simple procedure for the integration of the top emitting organic light emitting diode (TOLED), which permits minimum defects at the interface between a top metal electrode and an organic film. This method relies on the transfer of patterned metal electrodes to an organic substrate with a...

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Veröffentlicht in:Applied physics letters 2007-11, Vol.91 (19), p.192505-192505-3
Hauptverfasser: Seo, Soon-Min, Jang, Chang-Hyun
Format: Artikel
Sprache:eng
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Zusammenfassung:We report a simple procedure for the integration of the top emitting organic light emitting diode (TOLED), which permits minimum defects at the interface between a top metal electrode and an organic film. This method relies on the transfer of patterned metal electrodes to an organic substrate with a relatively high adhesive property. TOLED, integrated by the transfer fabrication, demonstrates better performance, a reduction of turn-on voltage and an increase of maximum current efficiency, in comparison with fabricated devices by conventional shadow mask method.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.2806274