Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition
The effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition technique were investigated. With increasing Al content, the leakage current characteristics improved, but the dielectric constant became smaller. Postannealing of the films at...
Gespeichert in:
Veröffentlicht in: | Applied physics letters 2007-03, Vol.90 (10) |
---|---|
Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | 10 |
container_start_page | |
container_title | Applied physics letters |
container_volume | 90 |
creator | Kim, Su Young Kwon, Hyuk Jo, Sang Jin Ha, Jeong Sook Park, Won Tae Kang, Dong Kyun Kim, Byong-Ho |
description | The effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition technique were investigated. With increasing Al content, the leakage current characteristics improved, but the dielectric constant became smaller. Postannealing of the films at temperatures up to 500°C reduced the leakage current density due to thermal stabilization by the addition of Al. For the 25-nm-thick La2.4AlO3.3 film, the authors obtained a dielectric constant of 22 and a leakage current density of 10−7A∕cm2 at 1V after postannealing at 450°C, which gives an equivalent oxide thickness of 3.8nm. |
doi_str_mv | 10.1063/1.2709951 |
format | Article |
fullrecord | <record><control><sourceid>crossref</sourceid><recordid>TN_cdi_crossref_primary_10_1063_1_2709951</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1063_1_2709951</sourcerecordid><originalsourceid>FETCH-LOGICAL-c159t-e3ce345f051d9ca8670d96a6399fd6905e58e62f71780bb8daa91b00e99276a43</originalsourceid><addsrcrecordid>eNotULtOwzAUtRBIlMLAH3hlSLmOazseq6pQpIouZY4c5xqM0jiyzSN8PS10OjrP4RByy2DGQPJ7NisVaC3YGZkwUKrgjFXnZAIAvJAH_ZJcpfR-oKLkfEI-V86hzYkGRxcdtaHP2GcaeprfkGJ38KK3pqNDDAPG7PEvujHfi27c_lDnu32irzF89cfSzj_T9NGkHE1G2ozU5LD3lnZmxEhbHELy2Yf-mlw40yW8OeGUvDysdst1sdk-Pi0Xm8IyoXOB3CKfCweCtdqaSipotTSSa-1aqUGgqFCWTjFVQdNUrTGaNQCodamkmfMpufvftTGkFNHVQ_R7E8eaQX08rGb16TD-C5RBXnY</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition</title><source>AIP Journals Complete</source><source>AIP Digital Archive</source><creator>Kim, Su Young ; Kwon, Hyuk ; Jo, Sang Jin ; Ha, Jeong Sook ; Park, Won Tae ; Kang, Dong Kyun ; Kim, Byong-Ho</creator><creatorcontrib>Kim, Su Young ; Kwon, Hyuk ; Jo, Sang Jin ; Ha, Jeong Sook ; Park, Won Tae ; Kang, Dong Kyun ; Kim, Byong-Ho</creatorcontrib><description>The effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition technique were investigated. With increasing Al content, the leakage current characteristics improved, but the dielectric constant became smaller. Postannealing of the films at temperatures up to 500°C reduced the leakage current density due to thermal stabilization by the addition of Al. For the 25-nm-thick La2.4AlO3.3 film, the authors obtained a dielectric constant of 22 and a leakage current density of 10−7A∕cm2 at 1V after postannealing at 450°C, which gives an equivalent oxide thickness of 3.8nm.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/1.2709951</identifier><language>eng</language><ispartof>Applied physics letters, 2007-03, Vol.90 (10)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c159t-e3ce345f051d9ca8670d96a6399fd6905e58e62f71780bb8daa91b00e99276a43</citedby><cites>FETCH-LOGICAL-c159t-e3ce345f051d9ca8670d96a6399fd6905e58e62f71780bb8daa91b00e99276a43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Kim, Su Young</creatorcontrib><creatorcontrib>Kwon, Hyuk</creatorcontrib><creatorcontrib>Jo, Sang Jin</creatorcontrib><creatorcontrib>Ha, Jeong Sook</creatorcontrib><creatorcontrib>Park, Won Tae</creatorcontrib><creatorcontrib>Kang, Dong Kyun</creatorcontrib><creatorcontrib>Kim, Byong-Ho</creatorcontrib><title>Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition</title><title>Applied physics letters</title><description>The effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition technique were investigated. With increasing Al content, the leakage current characteristics improved, but the dielectric constant became smaller. Postannealing of the films at temperatures up to 500°C reduced the leakage current density due to thermal stabilization by the addition of Al. For the 25-nm-thick La2.4AlO3.3 film, the authors obtained a dielectric constant of 22 and a leakage current density of 10−7A∕cm2 at 1V after postannealing at 450°C, which gives an equivalent oxide thickness of 3.8nm.</description><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNotULtOwzAUtRBIlMLAH3hlSLmOazseq6pQpIouZY4c5xqM0jiyzSN8PS10OjrP4RByy2DGQPJ7NisVaC3YGZkwUKrgjFXnZAIAvJAH_ZJcpfR-oKLkfEI-V86hzYkGRxcdtaHP2GcaeprfkGJ38KK3pqNDDAPG7PEvujHfi27c_lDnu32irzF89cfSzj_T9NGkHE1G2ozU5LD3lnZmxEhbHELy2Yf-mlw40yW8OeGUvDysdst1sdk-Pi0Xm8IyoXOB3CKfCweCtdqaSipotTSSa-1aqUGgqFCWTjFVQdNUrTGaNQCodamkmfMpufvftTGkFNHVQ_R7E8eaQX08rGb16TD-C5RBXnY</recordid><startdate>20070305</startdate><enddate>20070305</enddate><creator>Kim, Su Young</creator><creator>Kwon, Hyuk</creator><creator>Jo, Sang Jin</creator><creator>Ha, Jeong Sook</creator><creator>Park, Won Tae</creator><creator>Kang, Dong Kyun</creator><creator>Kim, Byong-Ho</creator><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20070305</creationdate><title>Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition</title><author>Kim, Su Young ; Kwon, Hyuk ; Jo, Sang Jin ; Ha, Jeong Sook ; Park, Won Tae ; Kang, Dong Kyun ; Kim, Byong-Ho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c159t-e3ce345f051d9ca8670d96a6399fd6905e58e62f71780bb8daa91b00e99276a43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Su Young</creatorcontrib><creatorcontrib>Kwon, Hyuk</creatorcontrib><creatorcontrib>Jo, Sang Jin</creatorcontrib><creatorcontrib>Ha, Jeong Sook</creatorcontrib><creatorcontrib>Park, Won Tae</creatorcontrib><creatorcontrib>Kang, Dong Kyun</creatorcontrib><creatorcontrib>Kim, Byong-Ho</creatorcontrib><collection>CrossRef</collection><jtitle>Applied physics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Su Young</au><au>Kwon, Hyuk</au><au>Jo, Sang Jin</au><au>Ha, Jeong Sook</au><au>Park, Won Tae</au><au>Kang, Dong Kyun</au><au>Kim, Byong-Ho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition</atitle><jtitle>Applied physics letters</jtitle><date>2007-03-05</date><risdate>2007</risdate><volume>90</volume><issue>10</issue><issn>0003-6951</issn><eissn>1077-3118</eissn><abstract>The effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition technique were investigated. With increasing Al content, the leakage current characteristics improved, but the dielectric constant became smaller. Postannealing of the films at temperatures up to 500°C reduced the leakage current density due to thermal stabilization by the addition of Al. For the 25-nm-thick La2.4AlO3.3 film, the authors obtained a dielectric constant of 22 and a leakage current density of 10−7A∕cm2 at 1V after postannealing at 450°C, which gives an equivalent oxide thickness of 3.8nm.</abstract><doi>10.1063/1.2709951</doi></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0003-6951 |
ispartof | Applied physics letters, 2007-03, Vol.90 (10) |
issn | 0003-6951 1077-3118 |
language | eng |
recordid | cdi_crossref_primary_10_1063_1_2709951 |
source | AIP Journals Complete; AIP Digital Archive |
title | Effects of Al content on the electrical properties of LaxAlyOz films grown on TiN substrate by atomic layer deposition |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T17%3A12%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effects%20of%20Al%20content%20on%20the%20electrical%20properties%20of%20LaxAlyOz%20films%20grown%20on%20TiN%20substrate%20by%20atomic%20layer%20deposition&rft.jtitle=Applied%20physics%20letters&rft.au=Kim,%20Su%20Young&rft.date=2007-03-05&rft.volume=90&rft.issue=10&rft.issn=0003-6951&rft.eissn=1077-3118&rft_id=info:doi/10.1063/1.2709951&rft_dat=%3Ccrossref%3E10_1063_1_2709951%3C/crossref%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |