Theoretical and experimental investigation of valence band offsets for direct silicon bond hybrid orientation technology

Direct silicon bonding (DSB) for hybrid orientation technology has recently generated a lot of interest due to the significant performance enhancements reported for p-channel metal oxide semiconductor devices fabricated on alternative substrate orientations. This letter reports on the experimental o...

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Veröffentlicht in:Applied physics letters 2007-01, Vol.90 (4)
Hauptverfasser: Joshi, Sachin, Sahu, Bhagwan, Banerjee, Sanjay K., Ciucivara, Adrian, Kleinman, Leonard, Wise, Rick, Cleavelin, Rinn, Pinto, Angelo, Seacrist, Mike, Ries, Mike, Huang, Y.-T., Ma, Mike, Lin, C.-T.
Format: Artikel
Sprache:eng
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