Strain profiling of HfO2/Si(001) interface with high-resolution Rutherford backscattering spectroscopy

Strain depth profiles in HfO2 (3 nm)/Si(001) prepared by atomic-layer chemical vapor deposition have been measured using high-resolution Rutherford backscattering spectroscopy in combination with a channeling technique. It is found that the Si lattice is compressed in the vertical direction around t...

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Veröffentlicht in:Applied physics letters 2003-07, Vol.83 (2), p.296-298
Hauptverfasser: Nakajima, K., Joumori, S., Suzuki, M., Kimura, K., Osipowicz, T., Tok, K. L., Zheng, J. Z., See, A., Zhang, B. C.
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container_end_page 298
container_issue 2
container_start_page 296
container_title Applied physics letters
container_volume 83
creator Nakajima, K.
Joumori, S.
Suzuki, M.
Kimura, K.
Osipowicz, T.
Tok, K. L.
Zheng, J. Z.
See, A.
Zhang, B. C.
description Strain depth profiles in HfO2 (3 nm)/Si(001) prepared by atomic-layer chemical vapor deposition have been measured using high-resolution Rutherford backscattering spectroscopy in combination with a channeling technique. It is found that the Si lattice is compressed in the vertical direction around the interface. The observed maximum strain is about 1% at the interface and the strained region extends down to ∼3 nm from the interface.
doi_str_mv 10.1063/1.1592310
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title Strain profiling of HfO2/Si(001) interface with high-resolution Rutherford backscattering spectroscopy
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