Photocurrent method for characterizing the interface of hydrophobically bonded Si wafers

We report a simple and nondestructive photocurrent method for characterizing the bonding interface between two hydrophobically bonded Si wafers. The relationship of photocurrent versus wavelength was measured and analyzed. The direction of the photocurrent indicates the band-bending direction, and t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Applied physics letters 2003-02, Vol.82 (6), p.916-918
Hauptverfasser: Yu, L. S., Mages, P., Qiao, D., Jia, L., Yu, P. K. L., Lau, S. S., Suni, T., Henttinen, K., Suni, I.
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!