Surface recombination velocities on processed InGaP p-n junctions

InGaP p-n junction mesa diodes were fabricated by wet or dry etching, and the surface recombination velocities (Sv) measured from the size dependence of the current density-voltage characteristics. Within experimental error, the dry etching does not increase the S values, which are in the range 4.4–...

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Veröffentlicht in:Applied physics letters 1993-12, Vol.63 (26), p.3610-3612
Hauptverfasser: PEARTON, S. J, REN, F, HOBSON, W. S, ABERNATHY, C. R, MASAITIS, R. L, CHAKRABARTI, U. K
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container_end_page 3612
container_issue 26
container_start_page 3610
container_title Applied physics letters
container_volume 63
creator PEARTON, S. J
REN, F
HOBSON, W. S
ABERNATHY, C. R
MASAITIS, R. L
CHAKRABARTI, U. K
description InGaP p-n junction mesa diodes were fabricated by wet or dry etching, and the surface recombination velocities (Sv) measured from the size dependence of the current density-voltage characteristics. Within experimental error, the dry etching does not increase the S values, which are in the range 4.4–5.2×104 cm s−1. Subsequent low temperature annealing or plasma exposure did not degrade the surface properties of the mesa diodes, and some improvement was observed with (NH4)2Sx treatment. While the InGaP diodes are relatively insensitive to typical processing steps, comparable AlGaAs p-n junction show much larger changes in surface recombination velocities.
doi_str_mv 10.1063/1.110064
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subjects Condensed matter: electronic structure, electrical, magnetic, and optical properties
Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures
Electronic transport in interface structures
Exact sciences and technology
Iii-v semiconductor-to-semiconductor contacts, p-n junctions, and heterojunctions
Physics
title Surface recombination velocities on processed InGaP p-n junctions
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