Kinetics of nucleation and growth of Si on SiO2 in very low pressure SiH4 chemical vapor deposition

The initial growth kinetics for SiH4 chemical vapor deposition of Si on SiO2 at low temperature (500–600 °C) have been revealed using rapid thermal UHV-CVD, together with in situ H2 thermal desorption spectroscopy to titrate the amount of exposed Si surface. In the few mTorr pressure range, the reac...

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Veröffentlicht in:Applied physics letters 1992-12, Vol.61 (25), p.3035-3037
Hauptverfasser: DANA, S. S, LIEHR, M, ANDERLE, M, RUBLOFF, G. W
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container_end_page 3037
container_issue 25
container_start_page 3035
container_title Applied physics letters
container_volume 61
creator DANA, S. S
LIEHR, M
ANDERLE, M
RUBLOFF, G. W
description The initial growth kinetics for SiH4 chemical vapor deposition of Si on SiO2 at low temperature (500–600 °C) have been revealed using rapid thermal UHV-CVD, together with in situ H2 thermal desorption spectroscopy to titrate the amount of exposed Si surface. In the few mTorr pressure range, the reaction is heterogeneous, i.e., dominated by surface reaction. Below ∼0.7 monolayer Si coverage, the growth kinetics is rapid (∼t4), indicating spontaneous generation of new nuclei, while at higher coverage Si island growth dominates.
doi_str_mv 10.1063/1.108001
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subjects Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Physics
Solid surfaces and solid-solid interfaces
Surface and interface dynamics and vibrations
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
title Kinetics of nucleation and growth of Si on SiO2 in very low pressure SiH4 chemical vapor deposition
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