Low-temperature selective epitaxy by ultrahigh-vacuum chemical vapor deposition from SiH4 and GeH4/H2
Selective epitaxy of GexSi1−x in an ultrahigh-vacuum chemical vapor deposition reactor from SiH4 and GeH4/H2 is reported for the first time. Growth is performed at 600 °C on patterned wafers after an 800 °C bake which provides a clean silicon surface. Selective growth is maintained during a short in...
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Veröffentlicht in: | Applied physics letters 1991-05, Vol.58 (19), p.2096-2098 |
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Sprache: | eng |
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