N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning
The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and...
Gespeichert in:
Veröffentlicht in: | Electronics letters 2024-07, Vol.60 (13) |
---|---|
Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | 13 |
container_start_page | |
container_title | Electronics letters |
container_volume | 60 |
creator | Collins, Henry Akso, Emre Clymore, Christopher J. Khan, Kamruzzaman Hamwey, Robert Hatui, Nirupam Guidry, Matthew Keller, Stacia Mishra, Umesh K. |
description | The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length (
f
t
·L
G
) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum
f
t
·L
G
of 15.0 GHz·µm for an
L
G
of 100 nm. |
doi_str_mv | 10.1049/ell2.13272 |
format | Article |
fullrecord | <record><control><sourceid>crossref</sourceid><recordid>TN_cdi_crossref_primary_10_1049_ell2_13272</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1049_ell2_13272</sourcerecordid><originalsourceid>FETCH-crossref_primary_10_1049_ell2_132723</originalsourceid><addsrcrecordid>eNpjYBAyNNAzNDCx1E_NyTHSMzQ2MjdiYuA0NDY10LU0NIxgYeA0MDA01jU1tDThYOAqLs4Cco0sLc05GcL9HjVMKMjPSSxSSElNLQByilKTU4uLFdwT_RR8PYM9XH1DFMozSzIUUvMyEvOSU1MU0hRKFA5t91FwV0iqVEhPLElVSMlMzUlNLinKTFYoycjMy8vMS-dhYE1LzClO5YXS3Axabq4hzh66yUX5xcVFqWnxBUWZuYlFlfGGBvEgp8eDnB4PdroxSYoBxilMFg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning</title><source>Wiley Online Library Open Access</source><source>DOAJ Directory of Open Access Journals</source><source>Wiley Online Library Journals Frontfile Complete</source><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><creator>Collins, Henry ; Akso, Emre ; Clymore, Christopher J. ; Khan, Kamruzzaman ; Hamwey, Robert ; Hatui, Nirupam ; Guidry, Matthew ; Keller, Stacia ; Mishra, Umesh K.</creator><creatorcontrib>Collins, Henry ; Akso, Emre ; Clymore, Christopher J. ; Khan, Kamruzzaman ; Hamwey, Robert ; Hatui, Nirupam ; Guidry, Matthew ; Keller, Stacia ; Mishra, Umesh K.</creatorcontrib><description>The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length (
f
t
·L
G
) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum
f
t
·L
G
of 15.0 GHz·µm for an
L
G
of 100 nm.</description><identifier>ISSN: 0013-5194</identifier><identifier>EISSN: 1350-911X</identifier><identifier>DOI: 10.1049/ell2.13272</identifier><language>eng</language><ispartof>Electronics letters, 2024-07, Vol.60 (13)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-crossref_primary_10_1049_ell2_132723</cites><orcidid>0000-0001-9918-5700</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,860,27901,27902</link.rule.ids></links><search><creatorcontrib>Collins, Henry</creatorcontrib><creatorcontrib>Akso, Emre</creatorcontrib><creatorcontrib>Clymore, Christopher J.</creatorcontrib><creatorcontrib>Khan, Kamruzzaman</creatorcontrib><creatorcontrib>Hamwey, Robert</creatorcontrib><creatorcontrib>Hatui, Nirupam</creatorcontrib><creatorcontrib>Guidry, Matthew</creatorcontrib><creatorcontrib>Keller, Stacia</creatorcontrib><creatorcontrib>Mishra, Umesh K.</creatorcontrib><title>N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning</title><title>Electronics letters</title><description>The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length (
f
t
·L
G
) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum
f
t
·L
G
of 15.0 GHz·µm for an
L
G
of 100 nm.</description><issn>0013-5194</issn><issn>1350-911X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNpjYBAyNNAzNDCx1E_NyTHSMzQ2MjdiYuA0NDY10LU0NIxgYeA0MDA01jU1tDThYOAqLs4Cco0sLc05GcL9HjVMKMjPSSxSSElNLQByilKTU4uLFdwT_RR8PYM9XH1DFMozSzIUUvMyEvOSU1MU0hRKFA5t91FwV0iqVEhPLElVSMlMzUlNLinKTFYoycjMy8vMS-dhYE1LzClO5YXS3Axabq4hzh66yUX5xcVFqWnxBUWZuYlFlfGGBvEgp8eDnB4PdroxSYoBxilMFg</recordid><startdate>202407</startdate><enddate>202407</enddate><creator>Collins, Henry</creator><creator>Akso, Emre</creator><creator>Clymore, Christopher J.</creator><creator>Khan, Kamruzzaman</creator><creator>Hamwey, Robert</creator><creator>Hatui, Nirupam</creator><creator>Guidry, Matthew</creator><creator>Keller, Stacia</creator><creator>Mishra, Umesh K.</creator><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0001-9918-5700</orcidid></search><sort><creationdate>202407</creationdate><title>N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning</title><author>Collins, Henry ; Akso, Emre ; Clymore, Christopher J. ; Khan, Kamruzzaman ; Hamwey, Robert ; Hatui, Nirupam ; Guidry, Matthew ; Keller, Stacia ; Mishra, Umesh K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-crossref_primary_10_1049_ell2_132723</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Collins, Henry</creatorcontrib><creatorcontrib>Akso, Emre</creatorcontrib><creatorcontrib>Clymore, Christopher J.</creatorcontrib><creatorcontrib>Khan, Kamruzzaman</creatorcontrib><creatorcontrib>Hamwey, Robert</creatorcontrib><creatorcontrib>Hatui, Nirupam</creatorcontrib><creatorcontrib>Guidry, Matthew</creatorcontrib><creatorcontrib>Keller, Stacia</creatorcontrib><creatorcontrib>Mishra, Umesh K.</creatorcontrib><collection>CrossRef</collection><jtitle>Electronics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Collins, Henry</au><au>Akso, Emre</au><au>Clymore, Christopher J.</au><au>Khan, Kamruzzaman</au><au>Hamwey, Robert</au><au>Hatui, Nirupam</au><au>Guidry, Matthew</au><au>Keller, Stacia</au><au>Mishra, Umesh K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning</atitle><jtitle>Electronics letters</jtitle><date>2024-07</date><risdate>2024</risdate><volume>60</volume><issue>13</issue><issn>0013-5194</issn><eissn>1350-911X</eissn><abstract>The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length (
f
t
·L
G
) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum
f
t
·L
G
of 15.0 GHz·µm for an
L
G
of 100 nm.</abstract><doi>10.1049/ell2.13272</doi><orcidid>https://orcid.org/0000-0001-9918-5700</orcidid></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0013-5194 |
ispartof | Electronics letters, 2024-07, Vol.60 (13) |
issn | 0013-5194 1350-911X |
language | eng |
recordid | cdi_crossref_primary_10_1049_ell2_13272 |
source | Wiley Online Library Open Access; DOAJ Directory of Open Access Journals; Wiley Online Library Journals Frontfile Complete; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals |
title | N‐polar deep‐recess GaN MISHEMT with enhanced f t ·L G by gate dielectric thinning |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T21%3A01%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=N%E2%80%90polar%20deep%E2%80%90recess%20GaN%20MISHEMT%20with%20enhanced%20f%20t%20%C2%B7L%20G%20by%20gate%20dielectric%20thinning&rft.jtitle=Electronics%20letters&rft.au=Collins,%20Henry&rft.date=2024-07&rft.volume=60&rft.issue=13&rft.issn=0013-5194&rft.eissn=1350-911X&rft_id=info:doi/10.1049/ell2.13272&rft_dat=%3Ccrossref%3E10_1049_ell2_13272%3C/crossref%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |