Ductile dicing of LiNbO 3 ridge waveguide facets to achieve 0.29 nm surface roughness in single process step

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Veröffentlicht in:	Electronics letters 2017-12, Vol.53 (25), p.1672-1674
Hauptverfasser:	Carpenter, L.G., Berry, S.A., Gawith, C.B.E.
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Sprache:	eng
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container_title	Electronics letters
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creator	Carpenter, L.G. Berry, S.A. Gawith, C.B.E.
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doi_str_mv	10.1049/el.2017.2863
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title	Ductile dicing of LiNbO 3 ridge waveguide facets to achieve 0.29 nm surface roughness in single process step
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