A new metallization method of modified tannic acid photoresist patterning

Metal patterning from a modified tannic acid (TA-Boc-MA) photoresist and the processes are designed using protection of hydroxyl groups in tannic acid, formulation into a photoresist, an exposure and pattern treatment process, and metallization by electroless Ag deposition with silver ion solution. Keywords: Tannic acid; Positive photoresist; Metallization method; Metal patterning; Ag pattern. A new process of in situ Ag fine pattern formation by direct pattern transfer of a modified tannic acid photoresist and in situ electroless plating in an Ag ion solution was reported.