Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures
A new method is presented for the glancing angle deposition (GLAD) of inorganic micro- and nanostructures using polymeric relief structures as seeding sites. Conventional embossing processes in thermoset resins are used to produce the relief structures, which potentially facilitates large scale prod...
Gespeichert in:
| Veröffentlicht in: | Nano letters 2001-02, Vol.1 (2), p.71-73 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 73 |
|---|---|
| container_issue | 2 |
| container_start_page | 71 |
| container_title | Nano letters |
| container_volume | 1 |
| creator | Dick, B Sit, J. C Brett, M. J Votte, I. M. N Bastiaansen, C. W. M |
| description | A new method is presented for the glancing angle deposition (GLAD) of inorganic micro- and nanostructures using polymeric relief structures as seeding sites. Conventional embossing processes in thermoset resins are used to produce the relief structures, which potentially facilitates large scale production array production. By utilizing GLAD to control the film deposition conditions over these arrays, we have fabricated periodic lattices (2 μm periodicity) of both silicon dioxide pillars with a thickness of 1.58 μm and oblique nickel columns of thickness 0.60 μm. |
| doi_str_mv | 10.1021/nl0055153 |
| format | Article |
| fullrecord | <record><control><sourceid>acs_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1021_nl0055153</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>d144092842</sourcerecordid><originalsourceid>FETCH-LOGICAL-a353t-25b3cdbb984df64406e5704f17620fe5d69c465142b2912c39a2d60fe60afbd83</originalsourceid><addsrcrecordid>eNptUEtLw0AQXkTBWj34D_biwUN09tnmKKXWQsWi9Rw2-2hTkmzZTZH-ezdU2oswzAzM95gZhO4JPBGg5LmtAYQggl2gQcqQyTynl6d-zK_RTYxbAMiZgAFaT5vSx2gNXvr60NhQafxp68o6_NWFve72wUasUuCVbXa16ix2PuBuY_Es-J9ug73Dy8TzJlHnrQ9r1abuvdLBx5PELbpyqo727q8O0ffrdDV5yxYfs_nkZZEpJliXUVEybcoyLWqc5BykFSPgjowkBWeFkbnmUhBOS5oTqlmuqJFpIkG50ozZED0edXv3GKwrdqFqVDgUBIr-Q8XpQwn7cMTuVNSqdkG1uopnAu99RnDGKR2Lrd-HNl3wj94vUjNyOw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures</title><source>American Chemical Society Publications</source><creator>Dick, B ; Sit, J. C ; Brett, M. J ; Votte, I. M. N ; Bastiaansen, C. W. M</creator><creatorcontrib>Dick, B ; Sit, J. C ; Brett, M. J ; Votte, I. M. N ; Bastiaansen, C. W. M</creatorcontrib><description>A new method is presented for the glancing angle deposition (GLAD) of inorganic micro- and nanostructures using polymeric relief structures as seeding sites. Conventional embossing processes in thermoset resins are used to produce the relief structures, which potentially facilitates large scale production array production. By utilizing GLAD to control the film deposition conditions over these arrays, we have fabricated periodic lattices (2 μm periodicity) of both silicon dioxide pillars with a thickness of 1.58 μm and oblique nickel columns of thickness 0.60 μm.</description><identifier>ISSN: 1530-6984</identifier><identifier>EISSN: 1530-6992</identifier><identifier>DOI: 10.1021/nl0055153</identifier><language>eng</language><publisher>Washington, DC: American Chemical Society</publisher><subject>Applied sciences ; Cross-disciplinary physics: materials science; rheology ; Electronics ; Exact sciences and technology ; Materials science ; Microelectronic fabrication (materials and surfaces technology) ; Nanoscale materials and structures: fabrication and characterization ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Nano letters, 2001-02, Vol.1 (2), p.71-73</ispartof><rights>Copyright © 2001 American Chemical Society</rights><rights>2003 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a353t-25b3cdbb984df64406e5704f17620fe5d69c465142b2912c39a2d60fe60afbd83</citedby><cites>FETCH-LOGICAL-a353t-25b3cdbb984df64406e5704f17620fe5d69c465142b2912c39a2d60fe60afbd83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://pubs.acs.org/doi/pdf/10.1021/nl0055153$$EPDF$$P50$$Gacs$$H</linktopdf><linktohtml>$$Uhttps://pubs.acs.org/doi/10.1021/nl0055153$$EHTML$$P50$$Gacs$$H</linktohtml><link.rule.ids>314,776,780,2751,27055,27903,27904,56716,56766</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=14514270$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Dick, B</creatorcontrib><creatorcontrib>Sit, J. C</creatorcontrib><creatorcontrib>Brett, M. J</creatorcontrib><creatorcontrib>Votte, I. M. N</creatorcontrib><creatorcontrib>Bastiaansen, C. W. M</creatorcontrib><title>Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures</title><title>Nano letters</title><addtitle>Nano Lett</addtitle><description>A new method is presented for the glancing angle deposition (GLAD) of inorganic micro- and nanostructures using polymeric relief structures as seeding sites. Conventional embossing processes in thermoset resins are used to produce the relief structures, which potentially facilitates large scale production array production. By utilizing GLAD to control the film deposition conditions over these arrays, we have fabricated periodic lattices (2 μm periodicity) of both silicon dioxide pillars with a thickness of 1.58 μm and oblique nickel columns of thickness 0.60 μm.</description><subject>Applied sciences</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Nanoscale materials and structures: fabrication and characterization</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>1530-6984</issn><issn>1530-6992</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNptUEtLw0AQXkTBWj34D_biwUN09tnmKKXWQsWi9Rw2-2hTkmzZTZH-ezdU2oswzAzM95gZhO4JPBGg5LmtAYQggl2gQcqQyTynl6d-zK_RTYxbAMiZgAFaT5vSx2gNXvr60NhQafxp68o6_NWFve72wUasUuCVbXa16ix2PuBuY_Es-J9ug73Dy8TzJlHnrQ9r1abuvdLBx5PELbpyqo727q8O0ffrdDV5yxYfs_nkZZEpJliXUVEybcoyLWqc5BykFSPgjowkBWeFkbnmUhBOS5oTqlmuqJFpIkG50ozZED0edXv3GKwrdqFqVDgUBIr-Q8XpQwn7cMTuVNSqdkG1uopnAu99RnDGKR2Lrd-HNl3wj94vUjNyOw</recordid><startdate>20010201</startdate><enddate>20010201</enddate><creator>Dick, B</creator><creator>Sit, J. C</creator><creator>Brett, M. J</creator><creator>Votte, I. M. N</creator><creator>Bastiaansen, C. W. M</creator><general>American Chemical Society</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20010201</creationdate><title>Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures</title><author>Dick, B ; Sit, J. C ; Brett, M. J ; Votte, I. M. N ; Bastiaansen, C. W. M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a353t-25b3cdbb984df64406e5704f17620fe5d69c465142b2912c39a2d60fe60afbd83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Applied sciences</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Nanoscale materials and structures: fabrication and characterization</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Dick, B</creatorcontrib><creatorcontrib>Sit, J. C</creatorcontrib><creatorcontrib>Brett, M. J</creatorcontrib><creatorcontrib>Votte, I. M. N</creatorcontrib><creatorcontrib>Bastiaansen, C. W. M</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Nano letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Dick, B</au><au>Sit, J. C</au><au>Brett, M. J</au><au>Votte, I. M. N</au><au>Bastiaansen, C. W. M</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures</atitle><jtitle>Nano letters</jtitle><addtitle>Nano Lett</addtitle><date>2001-02-01</date><risdate>2001</risdate><volume>1</volume><issue>2</issue><spage>71</spage><epage>73</epage><pages>71-73</pages><issn>1530-6984</issn><eissn>1530-6992</eissn><abstract>A new method is presented for the glancing angle deposition (GLAD) of inorganic micro- and nanostructures using polymeric relief structures as seeding sites. Conventional embossing processes in thermoset resins are used to produce the relief structures, which potentially facilitates large scale production array production. By utilizing GLAD to control the film deposition conditions over these arrays, we have fabricated periodic lattices (2 μm periodicity) of both silicon dioxide pillars with a thickness of 1.58 μm and oblique nickel columns of thickness 0.60 μm.</abstract><cop>Washington, DC</cop><pub>American Chemical Society</pub><doi>10.1021/nl0055153</doi><tpages>3</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1530-6984 |
| ispartof | Nano letters, 2001-02, Vol.1 (2), p.71-73 |
| issn | 1530-6984 1530-6992 |
| language | eng |
| recordid | cdi_crossref_primary_10_1021_nl0055153 |
| source | American Chemical Society Publications |
| subjects | Applied sciences Cross-disciplinary physics: materials science rheology Electronics Exact sciences and technology Materials science Microelectronic fabrication (materials and surfaces technology) Nanoscale materials and structures: fabrication and characterization Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | Embossed Polymeric Relief Structures as a Template for the Growth of Periodic Inorganic Microstructures |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T20%3A26%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-acs_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Embossed%20Polymeric%20Relief%20Structures%20as%20a%20Template%20for%20the%20Growth%20of%20Periodic%20Inorganic%20Microstructures&rft.jtitle=Nano%20letters&rft.au=Dick,%20B&rft.date=2001-02-01&rft.volume=1&rft.issue=2&rft.spage=71&rft.epage=73&rft.pages=71-73&rft.issn=1530-6984&rft.eissn=1530-6992&rft_id=info:doi/10.1021/nl0055153&rft_dat=%3Cacs_cross%3Ed144092842%3C/acs_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |