Atomic Layer Deposition of Aluminum Oxide Thin Films from a Heteroleptic, Amidinate-Containing Precursor
A family of heteroleptic aluminum compounds were synthesized as potential precursors for aluminum oxide deposition by atomic layer deposition (ALD). The synthesis and thermal chemistry were considered in the context of precursor selection, and [MeC(NiPr)2]AlEt2 was selected as a precursor. It was us...
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Veröffentlicht in: | Chemistry of materials 2008-12, Vol.20 (23), p.7287-7291 |
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description | A family of heteroleptic aluminum compounds were synthesized as potential precursors for aluminum oxide deposition by atomic layer deposition (ALD). The synthesis and thermal chemistry were considered in the context of precursor selection, and [MeC(NiPr)2]AlEt2 was selected as a precursor. It was used to deposit aluminum oxide with a high growth rate (2.3−2.7 Å/cycle) at 175 °C, and the films were found to be uniform and smooth (4.71 Å rms roughness). |
doi_str_mv | 10.1021/cm802195b |
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The synthesis and thermal chemistry were considered in the context of precursor selection, and [MeC(NiPr)2]AlEt2 was selected as a precursor. It was used to deposit aluminum oxide with a high growth rate (2.3−2.7 Å/cycle) at 175 °C, and the films were found to be uniform and smooth (4.71 Å rms roughness).</description><identifier>ISSN: 0897-4756</identifier><identifier>EISSN: 1520-5002</identifier><identifier>DOI: 10.1021/cm802195b</identifier><language>eng</language><publisher>American Chemical Society</publisher><subject>Chemical Vapor Deposition ; Coatings, Thin films, and Monolayers ; Precursor Routes to Materials (including Polymer-Derived Ceramics)</subject><ispartof>Chemistry of materials, 2008-12, Vol.20 (23), p.7287-7291</ispartof><rights>Copyright © 2008 American Chemical Society</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a297t-90d3dd69e84e6677b6c4a919ad1726ccdc64822ee9505e752305a7be9dd49da13</citedby><cites>FETCH-LOGICAL-a297t-90d3dd69e84e6677b6c4a919ad1726ccdc64822ee9505e752305a7be9dd49da13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://pubs.acs.org/doi/pdf/10.1021/cm802195b$$EPDF$$P50$$Gacs$$H</linktopdf><linktohtml>$$Uhttps://pubs.acs.org/doi/10.1021/cm802195b$$EHTML$$P50$$Gacs$$H</linktohtml><link.rule.ids>314,776,780,2752,27053,27901,27902,56713,56763</link.rule.ids></links><search><creatorcontrib>Brazeau, Allison L</creatorcontrib><creatorcontrib>Barry, Seán T</creatorcontrib><title>Atomic Layer Deposition of Aluminum Oxide Thin Films from a Heteroleptic, Amidinate-Containing Precursor</title><title>Chemistry of materials</title><addtitle>Chem. Mater</addtitle><description>A family of heteroleptic aluminum compounds were synthesized as potential precursors for aluminum oxide deposition by atomic layer deposition (ALD). The synthesis and thermal chemistry were considered in the context of precursor selection, and [MeC(NiPr)2]AlEt2 was selected as a precursor. It was used to deposit aluminum oxide with a high growth rate (2.3−2.7 Å/cycle) at 175 °C, and the films were found to be uniform and smooth (4.71 Å rms roughness).</description><subject>Chemical Vapor Deposition</subject><subject>Coatings, Thin films, and Monolayers</subject><subject>Precursor Routes to Materials (including Polymer-Derived Ceramics)</subject><issn>0897-4756</issn><issn>1520-5002</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNpt0EFLwzAcBfAgCs7pwW-QiwfBatI1SXMc0zlhuoETjyFL_nOZbTOSFLZvb2Wyk6d3-fHgPYSuKbmnJKcPpi67kGx5gnqU5SRjhOSnqEdKKbJCMH6OLmLcEEI7XvbQeph87Qye6j0E_AhbH11yvsF-hYdVW7umrfFs5yzgxdo1eOyqOuJV8DXWeAIJgq9gm5y5w8PaWdfoBNnIN0m7xjVfeB7AtCH6cInOVrqKcPWXffQxflqMJtl09vwyGk4znUuRMknswFouoSyAcyGW3BRaUqktFTk3xhpelHkOIBlhIFg-IEyLJUhrC2k1HfTR7aHXBB9jgJXaBlfrsFeUqN-L1PGizmYH62KC3RHq8K24GAimFvN39coWn8Ubl0p0_ubgtYlq49vQdEv-6f0BOUd1GQ</recordid><startdate>20081209</startdate><enddate>20081209</enddate><creator>Brazeau, Allison L</creator><creator>Barry, Seán T</creator><general>American Chemical Society</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20081209</creationdate><title>Atomic Layer Deposition of Aluminum Oxide Thin Films from a Heteroleptic, Amidinate-Containing Precursor</title><author>Brazeau, Allison L ; Barry, Seán T</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a297t-90d3dd69e84e6677b6c4a919ad1726ccdc64822ee9505e752305a7be9dd49da13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Chemical Vapor Deposition</topic><topic>Coatings, Thin films, and Monolayers</topic><topic>Precursor Routes to Materials (including Polymer-Derived Ceramics)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Brazeau, Allison L</creatorcontrib><creatorcontrib>Barry, Seán T</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><jtitle>Chemistry of materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Brazeau, Allison L</au><au>Barry, Seán T</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Atomic Layer Deposition of Aluminum Oxide Thin Films from a Heteroleptic, Amidinate-Containing Precursor</atitle><jtitle>Chemistry of materials</jtitle><addtitle>Chem. Mater</addtitle><date>2008-12-09</date><risdate>2008</risdate><volume>20</volume><issue>23</issue><spage>7287</spage><epage>7291</epage><pages>7287-7291</pages><issn>0897-4756</issn><eissn>1520-5002</eissn><abstract>A family of heteroleptic aluminum compounds were synthesized as potential precursors for aluminum oxide deposition by atomic layer deposition (ALD). The synthesis and thermal chemistry were considered in the context of precursor selection, and [MeC(NiPr)2]AlEt2 was selected as a precursor. It was used to deposit aluminum oxide with a high growth rate (2.3−2.7 Å/cycle) at 175 °C, and the films were found to be uniform and smooth (4.71 Å rms roughness).</abstract><pub>American Chemical Society</pub><doi>10.1021/cm802195b</doi><tpages>5</tpages></addata></record> |
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subjects | Chemical Vapor Deposition Coatings, Thin films, and Monolayers Precursor Routes to Materials (including Polymer-Derived Ceramics) |
title | Atomic Layer Deposition of Aluminum Oxide Thin Films from a Heteroleptic, Amidinate-Containing Precursor |
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