Reducing the Coefficient of Thermal Expansion of Polyimide Films in Microelectronics Processing Using ZnS Particles at Low Concentrations

We report a reduction in the coefficient of thermal expansion (CTE) of polyimide (PI) film in microelectronics processing by using ZnS particles as nanofillers. To prevent agglomeration of ZnS particles, the surfaces of ZnS particles were modified with the (3-mercaptopropyl)­trimethoxysilane, creati...

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Veröffentlicht in:	ACS applied nano materials 2018-03, Vol.1 (3), p.1076-1082
Hauptverfasser:	Jeon, Hyungjoon, Yoon, Cheolsang, Song, Young-Geon, Han, Junwon, Kwon, Sujin, Kim, Seungwon, Chang, Insu, Lee, Kangtaek
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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