Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes

The formation of low-temperature solution-processed electrodes from cost-effective and abundant materials is expected to realize all-solution-processed film devices. Silver microplates (AgMLs) can replace metal electrodes formed via high-energy and high-material-consuming processes such as vacuum-ev...

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Veröffentlicht in:	ACS applied electronic materials 2022-11, Vol.4 (11), p.5538-5549
Hauptverfasser:	Furusawa, Takumi, Ando, Rin, Daiguji, Hiroaki, Jang, Jeongmin, Funabe, Mikuto, Matsui, Jun, Ishizaki, Manabu, Kurihara, Masato
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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